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Trans Tech recently debuted the all-electric eTrans school bus providing a total zero emission school bus. The presentation will demonstrate Smith Electric Vehicles and their history with electric vehicles. The presentation will help ensure that everybody has an idea of what the electric school bus will do and to dispel any rumors about the vehicle. Presenter Brian S. Barrington, Trans Tech. Bus

A main challenge when developing next generation architectures for automated driving ECUs is to guarantee reliable functionality. Today’s fail safe systems will not be able to handle electronic failures due to the missing “mechanical” fallback or the intervening driver. This means, fail operational based on redundancy is an essential part for improving the functional safety, especially in safety-related braking and steering systems. The 2-out-of-2 Diagnostic Fail Safe (2oo2DFS) system is a promising approach to realize redundancy with manageable costs. In this contribution, we evaluate the reliability of this concept for a symmetric and an asymmetric Electronic Power Steering (EPS) ECU. For this, we use a Markov chain model as a typical method for analyzing the reliability and Mean Time To Failure (MTTF) in majority redundancy approaches. As a basis, the failure rates of the used components and the microcontroller are considered.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers with incredible levels of peripheral integration. As a result, performance can no longer be measured in MIPS (Millions of Instructions Per Second). A microcontroller's effectiveness is based on coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, the designer needs benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment.

Today the majority of power electronics is developed based on the requirements set by the main fields of application e.g. power generation, power supply, industrial drive and traction. With introduction to automotive applications new requirements have to be taken into account. This paper discusses how interconnection technologies for power semiconductors can be improved to meet the demand for higher temperature capability in HEV applications.

Position detection and control is necessary in modern automotive applications because of remotely controlled actuators, such as window lifters or windshield. In recent years, the demand for reliable actuators for safety critical systems, such as power steering systems, has also increased significantly. This creates a growing demand for fast, accurate and efficient servo motor systems that are increasingly smarter, smaller and cheaper. One interesting option is to use Giant Magneto Resistive (GMR) angle sensors to replace the resolvers, Hall, inductive and Anisotropic Magneto Resistive Effect (AMR) Sensors commonly used today for shaft-angle measurements. In principle, there are functional differences among various angle measurement technologies; thus, the effect of switching between them needs to be analyzed.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers whose performance can no longer be measured in MIPS. Instead, their effectiveness is based on a coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, what the designer needs are benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment. This presentation will explore the role of new benchmarks in the development of complex automotive applications.

The increasingly stringent requirements in relation to emission reduction and onboard diagnostics are pushing the Chinese automotive industry toward more innovative solutions and a rapid increase in electronic control performance. To manage the system complexity the architecture will require being well structure on hardware and software level. The paper introduces GEMS-K1 (Gasoline Engine Management System - Kit 1). GEMS-K1 is a platform being compliant with Euro IV emission regulation for gasoline engines. The application software is developed using modeling language, the code is automatically generated from the model. The driver software has a well defined structure including microcontroller abstraction layer and ECU abstraction layer. The hardware is following design rules to be robust, 100% testable and easy to manufacture. The electronic components use the latest innovation in terms of architecture and technologies.

Driven by factors like consumption, power output per liter, comfort and more stringent exhaust gas standards the powertain control area, has developed rapidly in the last decades. This trend has also brought with it many innovations in the ignition application. Today we can see a trend to Pencil-coil or Plug-top-coil ignition systems. The next step in system partitioning is to remove the power driver from the ECU and place it directly in/on the coil body. The advantages of the new partitioning - e.g. no high voltage wires, reduced power dissipation on the ECU - are paid with different, mainly tougher requirements for the electronic components. By using specialized technologies for the different functions - IGBT for switching the power, SPT for protection, supply and diagnostics - in chip-on-chip technology all required functions for a decentralized ignition system can be realized in a TO220/ TO263 package.

As the demand for enhanced comfort, safety and differentiation with new features continues to grow and as electronics and software enable most of these, the number of electronic units or components within automobiles will continue to increase. This will increase the overall system complexity, specifically with respect to the number of controller actuators such as e-motors. However, hard constraints on cost and on physical boundaries such as maximum power dissipation per unit and pin-count per unit/connector require new solutions to alternative system partitioning. Vehicle manufacturers, as well as system and semiconductor suppliers are striving for increased scalability and modularity to allow for most cost optimal high volume configurations while featuring platform reuse and feature differentiation. This paper presents new semiconductor based approaches with respect to technologies, technology mapping and assembly technologies.

In terms of modern technical systems, the automotive sector is characterized by escalating complexity and functionality requirements. The development of embedded control systems has to meet highest demands regarding process-, time- and cost-optimization. Hence, the efficiency of software development becomes a crucial competitive advantage. Systems design engineers need effective tools and methods to achieve exemplary speed and productivity within the development phase. To obtain such tools and methods, semiconductor manufacturers and tool manufacturers must work closely together. Within the joint efforts of ETAS and Infineon, the software tool suite ASCET-SD was enhanced to generate efficient C code for Infineon's TriCore architecture mapped on ETAS's real-time operating system ERCOSEK. The processor interface to application & calibration tools was realized using the ETK probe based on a JTAG/Nexus link at very high bandwidth.

This paper presents the objectives and preliminary results of the BRAKE project - a joint effort of Delphi Automotive Systems, Infineon Technologies, Volvo Car Corporation and WindRiver. The objective of this project is to use microelectronics technologies to design a distributed Brake-by-Wire system including: A distributed fault tolerant system for enhanced safety An extension of the OSEK based operating system for a distributed time triggered architecture An open interface between vehicle control, and brake system control The results comprise the requirements, interface specification (see [1]), a full simulation model, a hardware-in-the-loop bench, and a demonstration vehicle. The application has been developed using advanced automatic code generation for Infineon's TriCore based automotive microcontrollers.

The concept of “Simulatable Specifications” is applied to a Smart Bridge-Driver-IC in order to support an integrated development process of a Direct Injection System. It is demonstrated that the impact of the IC concept on system performance can be investigated long before first Silicon is available. Thus, considerable time in systems development can be saved and, in addition, the feedback loop for conceptual redesigns of the chip is reduced by up to 60 percent.

A cooperation of several research partners supported by the German Federal Ministry of Research and Education proposes a new active matrix LED light source. A multi pixel flip chip LED array is directly mounted to an active driver IC. A total of 1024 pixel can be individually addressed through a serial data bus. Several of these units are integrated in a prototype headlamp to enable advanced light distribution patterns in an evaluation vehicle.

The automotive industry experiences a major change as vehicles are gradually becoming a part of the Internet. Security concepts based on the closed-world assumption cannot be deployed anymore due to a constantly changing adversary model. Automotive Ethernet as future in-vehicle network and a new E/E Architecture have different security requirements than Ethernet known from traditional IT and legacy systems. In order to achieve a high level of security, a new multi-layer approach in the vehicle which responds to special automotive requirements has to be introduced. One essential layer of this holistic security concept is to restrict non-authorized access by the deployment of embedded firewalls. This paper addresses the introduction of automotive firewalls into the next-generation domain architecture with a focus on partitioning of its features in hardware and software.

ISO 26262 is the actual standard for Functional Safety of automotive E/E (Electric/Electronic) systems. One of the challenges in the application of the standard is the distribution of safety related activities among the participants in the supply chain. In this paper, the concept of a Safety Element out of Context (SEooC) development will be analyzed showing its current problematic aspects and difficulties in implementing such an approach in a concrete typical automotive development flow with different participants (e.g. from OEM, tier 1 to semiconductor supplier) in the supply chain. The discussed aspects focus on the functional safety requirements of generic hardware and software development across the supply chain where the final integration of the developed element is not known at design time and therefore an assumption based mechanism shall be used.

In modern vehicles, the number of small electrical drive systems is still increasing continuously for blowers, fans and pumps as well as for window lifts, sunroofs and doors. Requirements and operating conditions for such systems varies, hence there are many different solutions available for controlling such motors. In most applications, simple, low-cost DC motors are used. For higher requirements regarding operating time and in stop-start capable systems, the focus turns to highly efficient and durable brushless DC motors with electronic commutation. This paper compares various electronic control concepts from a semiconductor vendor point of view. These concepts include discrete control using relays or MOSFETs. Furthermore integrated motor drivers are discussed, including system-on-chip solutions for specific applications, e.g. specific ICs for window lift motors with LIN interface.

The electrification of the powertrain is still one of the main challenges and innovation drivers for modern cars. With the introduction of the Toyota Prius, launched in Japan in 1997 the first commercially available hybrid car in mass production, the development continued towards the BMW i3 launched in July 2013. One main component for all kind of hybrid cars is still the power semiconductor, which is used for DC/DC converters and for the inverter to drive the electric motor for the traction control. What makes the selection of the right power semiconductor complex, is the variety of different voltage levels within the car (from standard 12V board net, the new 48V board net all the way up to 400V and above) plus different requirements in terms of switching and conduction performance, or accordingly power losses. The selection of device by application and voltage will be discussed in this paper.

The infrastructure in modern cars is a heterogeneous and historically grown network of different field buses coupling different electronic control units (ECUs) from different sources. In the past years, the amount of ECUs in the network has rapidly grown due to the mushrooming of new functions which historically were mostly implemented on a one-ECU-per-function basis resulting in up to a hundred ECUs in fully equipped luxury cars. Additionally, new functions like parking assist systems or advanced chassis control functions are getting increasingly complex and require more computing power. These two facts add up to a complex challenge in development. The current trend to host several functions in single ECUs as integration platforms is one attempt to address this challenge. This trend is supported by the increased computing power of current and upcoming multi-core microcontrollers.

This paper shall present advancements in electronic transmission control circuits addressing new challenges in the gearbox striving for improved vehicle efficiency and comfort of driving. Efficient chipset design, requires finding the optimal partitioning, that is the mapping of functionality to hardware or software and analog or digital circuit technology. The efficiency will be judged by minimal cost whilst achieving improved functionality and required scalability for a platform approach. Specific examples demonstrated are smart sensor architecture and new mapping of control strategies, realized with a novice integrated current control IC concept. Comparisons on system level are used to evaluate different function mappings as well as component partitioning. Details of the most optimized mapping and partitioning will be elaborated and first results of implementation in silicon components will be shown.

The number of safety critical automotive applications employing high current brushless motors continues to increase (Steering, Braking, and Transmission etc.). There are many benefits when moving from traditional solutions to electrically actuated solutions. Some of these benefits can include increased fuel economy, simplified vehicle installation and packaging, increased feature set, improved safety and/or convenience, simplified unit assembly and modular testability prior as well as during vehicle manufacturing. The trend to implement brushless motors in these applications (which require electronically controlled commutation) has also brought with it the need for powerful inverters, which primarily consist of Power MOSFETs and MOSFET Driver ICs. This paper reviews the challenges associated with the design of safety critical electronic systems which combine sensing, control and actuation.