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The increasing power requirement for automotive electronics (radios, etc.), combined with ever-shrinking size and weight allowances, is creating a greater need for optimization and robust design of heat sinks. Not only does a heat sink directly affect the overall performance and reliability of a specific electronics application, but a well-designed, optimized heat sink can have other benefits - such as eliminating the requirement for special fans, reducing weight of the application, eliminating additional heat sink support structures, etc. Optimizing heat sink efficiency and thermal performance offers a challenge, due to the many competing design requirements. These requirements include effecting greater temperature reductions, accommodating vehicle packaging requirements and size limitations, generating a uniform heat distribution, etc., and all the while reducing the heat sink cost.