This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision). This document provides reference information concerning acceleration factors commonly used by device manufacturers to model failure rates in conjunction with statistical reliability monitoring. These acceleration factors are frequently used by OEMs in conjunction with physics of failure reliability analysis to assess the suitability of plastic encapsulated microcircuits and semiconductors for specific end use applications.
The exponential increase in the number of aircraft and air travelers has triggered new innovations aimed to make airline services more reliable and consumer friendly. Quick and efficient maintenance actions with minimum downtime are the need of the hour. Another major challenge is ensuring maintenance personnel are trained effectively; technology like augmented reality and Virtual Maintenance Trainers (VMTs) may provide safe and efficient training in lieu of live, instructor-led arrangements. And while traditional User/Maintenance Manuals provide useful information when dealing with simple machines, when dealing with complex systems of systems and miniaturized technologies, like unmanned aerial vehicles (UAVs), new technologies like augmented reality can rapidly and effectively support the maintenance operations.