This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision). This document provides reference information concerning acceleration factors commonly used by device manufacturers to model failure rates in conjunction with statistical reliability monitoring. These acceleration factors are frequently used by OEMs in conjunction with physics of failure reliability analysis to assess the suitability of plastic encapsulated microcircuits and semiconductors for specific end use applications.
This SAE Recommended Practice applies to both Original Equipment Manufacturer (OEM) and aftermarket message-generating systems for light and heavy vehicles. The recommended practice covers both message prioritization and presentation (including simultaneous display of messages) for visual and auditory modalities. In addition, this recommended practice will consider temporal aspects of external events (e.g. merging into heavy traffic, time-to-collision) and their impact on temporal presentation and format (including multi-modal) of messages.
This SAE Aerospace Standard covers high strength commercial sockets and universal sockets which possess the strength, clearances, and internal wrenching design so configured that, when mated with hexagon (6 point) fasteners, they shall transmit torque to the fastener without bearing on the outer 5% of the fastener’s wrenching points. This document provides additional requirements beyond ANSI B107.5 appropriate for aerospace use. Inclusion of dimensional data in this document is not intended to imply all of the products described therein are stock production sizes. Consumers are requested to consult with manufacturers concerning lists of stock production sizes.