This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision). This document provides reference information concerning acceleration factors commonly used by device manufacturers to model failure rates in conjunction with statistical reliability monitoring. These acceleration factors are frequently used by OEMs in conjunction with physics of failure reliability analysis to assess the suitability of plastic encapsulated microcircuits and semiconductors for specific end use applications.
The purpose of this SAE Information Report is to provide general information relative to the nature and use of eddy current techniques for nondestructive testing. The document is not intended to provide detailed technical information but to serve as an introduction to the principles and capabilities of eddy current testing, and as a guide to more extensive references listed in Section 2.