This part of SAE J551 specifies on-board transmitter simulation test methods and procedures for testing passenger cars and commercial vehicles. The electromagnetic disturbances considered in this part of SAE J551 are limited to continuous narrow band electromagnetic fields. SAE J551/1 specifies general, definitions, practical use, and basic principles of the test procedure.
This SAE Recommended Practice applies to rigid bumper or rigid structure points and flexible components of passenger cars, multipurpose passenger vehicles, and light trucks. This document is intended as a guide toward standard practice and is subject to change to keep pace with experience and technical advances.
This document describes the collection of IUMPR data required by the Heavy Duty On-Board Diagnostic regulation 13 CCR 1971.1 (l)(2.3.3), using SAE J1939-defined messages incorporated in a suite of software functions.
In "Simulation Tools for Engine Design" engineers from Ricardo Software discuss the use of simulation software in new powertrain development. Another engineer, this time from General Motors, talks about how simulation tools helped them solve the challenge of fuel flow reversion while designing the new turbocharged Cadillac V6 engine. This episode highlights: • The challenge of simulating complex and combined systems in one vehicle • An example of how a library of components in a software package can be chosen to form a specific system and analyzed • How computational fluid dynamics simulation tools were used to help redesign a new planum
This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision). This document provides reference information concerning acceleration factors commonly used by device manufacturers to model failure rates in conjunction with statistical reliability monitoring. These acceleration factors are frequently used by OEMs in conjunction with physics of failure reliability analysis to assess the suitability of plastic encapsulated microcircuits and semiconductors for specific end use applications.