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Technical Paper

A Test Method for Quantifying Residual Stress Due to Heat Treatment in Metals

2006-04-03
2006-01-0319
Quantification of residual stresses is an important engineering problem impacting manufacturabilty and durability of metallic components. An area of particular concern is residual stresses that can develop during heat treatment of metallic components. Many heat treatments, especially in heat treatable cast aluminum alloys, involve a water-quenching step immediately after a solution-treatment cycle. This rapid water quench has the potential to induce high residual stresses in regions of the castings that experience large thermal gradients. These stresses may be partially relaxed during the aging portion of the heat treatment. The goal of this research was to develop a test sample and quench technique to quantify the stresses created by steep thermal gradients during rapid quenching of cast aluminum. The development and relaxation of residual stresses during the aging cycle was studied experimentally with the use of strain gauges.
Technical Paper

A Comparative Study of Two RVE Modelling Methods for Chopped Carbon Fiber SMC

2017-03-28
2017-01-0224
To advance vehicle lightweighting, chopped carbon fiber sheet molding compound (SMC) is identified as a promising material to replace metals. However, there are no effective tools and methods to predict the mechanical property of the chopped carbon fiber SMC due to the high complexity in microstructure features and the anisotropic properties. In this paper, a Representative Volume Element (RVE) approach is used to model the SMC microstructure. Two modeling methods, the Voronoi diagram-based method and the chip packing method, are developed to populate the RVE. The elastic moduli of the RVE are calculated and the two methods are compared with experimental tensile test conduct using Digital Image Correlation (DIC). Furthermore, the advantages and shortcomings of these two methods are discussed in terms of the required input information and the convenience of use in the integrated processing-microstructure-property analysis.
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