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Application of Direct Pressure to Resin in Curing of Epoxy and Addition Type Polyimides

1989-01-01
CURRENT
ARP1927
This recommended practice describes the materials, related equipment, and particular processing techniques utilized in process science curing of composite hardware where pressure is imparted specifically to the resin of curing composites. Included as Appendix "A" to this ARP is a discussion of the particular techniques developed for a processing science philosophy which has consistently produced void and porosity-free, large area, thick composite structures.
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