This recommended practice describes the materials, related equipment, and particular processing techniques utilized in process science curing of composite hardware where pressure is imparted specifically to the resin of curing composites. Included as Appendix "A" to this ARP is a discussion of the particular techniques developed for a processing science philosophy which has consistently produced void and porosity-free, large area, thick composite structures.
This specification establishes the requirements for a nominal 250 °F cure epoxy preimpregnated carbon fiber plain weave fabric product. The prepreg is a plain weave fabric with 12K tows, a nominal fiber areal weight of 193 gsm, and nominal resin content of 42%.
This recommended practice describes the physical and chemical characterization techniques for identification of epoxy adhesive and prepreg resin systems in order to verify the chemical formulation, resin B-staging (See 8.1), cure reaction rates, adhesive moisture content, and resin component mix ratios, as necessary to achieve manufacturing and quality producibility and engineering performance.