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Standard

Mold Release Agent

1993-10-01
CURRENT
AMS3091C
This specification covers a mold release agent in the form of a liquid.
Standard

Application of Direct Pressure to Resin in Curing of Epoxy and Addition Type Polyimides

1989-01-01
CURRENT
ARP1927
This recommended practice describes the materials, related equipment, and particular processing techniques utilized in process science curing of composite hardware where pressure is imparted specifically to the resin of curing composites. Included as Appendix "A" to this ARP is a discussion of the particular techniques developed for a processing science philosophy which has consistently produced void and porosity-free, large area, thick composite structures.
Standard

Physical-Chemical Characterization Techniques, Epoxy Adhesive and Prepreg Resin Systems

1985-04-01
CURRENT
ARP1610A
This recommended practice describes the physical and chemical characterization techniques for identification of epoxy adhesive and prepreg resin systems in order to verify the chemical formulation, resin B-staging (See 8.1), cure reaction rates, adhesive moisture content, and resin component mix ratios, as necessary to achieve manufacturing and quality producibility and engineering performance.
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