Artificial intelligence (AI) and machine learning (ML) will continue to bring about significant changes in aircraft cockpits and help move commercial, military, and general and business aircraft from automated to autonomous systems, affirm subject-matter experts at Wind River in Alameda, California, and Collins Aerospace in Cedar Rapids, Iowa.
In contrast to the stiff, rigid wings found on most commercial aircraft, flexible wing technology is considered essential to next generation, fuel efficient aircraft. However, flexible wings are susceptible to “flutter,” or highly destructive aeroelastic instability. To better understand and mitigate flutter, engineers at NASA’s Armstrong Flight Research Center (AFRC) equipped the X-56 with fiber optic sensing (FOS) technology.
CEO Claus Moehlenkamp explains how the supplier is expanding beyond the important business of seals, gaskets, and O-rings to supply battery packs and hydrogen fuel-cell stacks for heavy-duty mobility applications.
Kepler Communications, Inc.’s (Kepler’s) TARS six-unit cubesat – the company’s third satellite scheduled for launch later this year – will feature an innovative smart radiator device (SRD) designed to significantly optimize heat dissipation on communication satellites where environmental conditions have a big impact on transmission signals.
The British construction equipment manufacturer has expanded its X Series crawler excavator line with the launch of three models in the popular 13- to 16-tonne sector. This follows the successful introduction of the 210X and 220X last year, both competing in the 21-tonne category.
As part of its ongoing Wi-Fi 6 program, the Wireless Broadband Alliance (WBA) – an industry association focused on next generation Wi-Fi services and interoperability – is starting the world’s first Wi-Fi 6 Industrial Enterprise and Internet of Things (IoT) trial at Mettis Aerospace Limited’s (Mettis Aerospace’s) 27-acre West Midlands facility.
Nano Dimension Ltd., an additive electronics provider based in Ness Ziona, Israel, has developed the world’s first side-mounting technology for printed circuit boards (PCBs) produced through additive manufacturing (AM) or “3D-printing.” The side mounted designs allow for more functionality on circuit boards, which will impact Internet of Things (IoT) and Industry 4.0 applications where customized designs and shapes are a growing demand.