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This paper will outline the results of a study performed to analyze the market introduction of x-by-wire applications in the context of weak global industry environment, technological and legislative challenges, standardization issues and end customer benefits. This paper attempts to provide a bird-view on influence factors and impacts for the x-by-wire market, including e.g. the end customer's acceptance and legal environment driving further development in specific areas. Further, major driving forces on semiconductor/component level will be outlined regarding e.g. pin-count, computation performance and heat dissipation, but also possible scenarios and solutions towards safe and efficient system design and partitioning.

Automotive powertrain and safety systems under design today are highly complex, incorporating more than one CPU core, running with more than 100 MHz and consisting of several 10 million transistors. Software complexity increases similarly making new methodologies and tools mandatory to manage the overall system. The use of accurate virtual prototypes improves the quality of systems with respect to system architecture design and software development. This approach is demonstrated with the example of the PCP/GPTA subsystem for Infineon's AUDO-NG powertrain controllers.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers whose performance can no longer be measured in MIPS. Instead, their effectiveness is based on a coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, what the designer needs are benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment. This presentation will explore the role of new benchmarks in the development of complex automotive applications.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers with incredible levels of peripheral integration. As a result, performance can no longer be measured in MIPS (Millions of Instructions Per Second). A microcontroller's effectiveness is based on coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, the designer needs benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment.

Trans Tech recently debuted the all-electric eTrans school bus providing a total zero emission school bus. The presentation will demonstrate Smith Electric Vehicles and their history with electric vehicles. The presentation will help ensure that everybody has an idea of what the electric school bus will do and to dispel any rumors about the vehicle. Presenter Brian S. Barrington, Trans Tech. Bus

Increasing fuel costs and emission regulations force the car manufacturers to develop powerful but efficient engines. The 3-liter car (3-liter/100 km fuel consumption → 80 miles/gallon) is one of the slogans. To fulfill these requirements a fully electronic controlled Engine Management is necessary. Carburetor systems are replaced by fuel injection systems. Direct injection for Diesel as well as for gasoline engines is the clear trend for the future. The mechanical throttle systems, used for a long time will not fit to the requirements of direct injection. A DC motor for electronic throttle control in conjunction with λ regulation and exhaust gas recirculation are the key elements for low emission cars. Also the automotive ignition system is in a process of change today.

For highly automated driving, commercial vehicles require an Electric/Electronic (E/E) architecture, which - in addition to sensor fusion - ensures safety-critical processes such as steering and braking at all times. Among other things, a redundant 24 V supply with corresponding disconnection is required. The battery switch is a key component. Commercial, construction, and agricultural vehicles (CAV) need to operate at the highest possible availability and the lowest possible cost of ownership. This is why automated and autonomous driving has the potential to revolutionize the CAV sector. Driverless machines can be operated around the clock and almost non-stop. Platooning allows automated, interconnected trucks to drive in a convoy and very close to each other. Platooning saves fuel.

Single Edge Nibble Transmission (SENT) is a promising low-cost solution for communication between off-ECU sensors and a microcontroller. First, this paper analyses the advantages of digital sensors with a special focus on position sensors. The possible integration of SENT in other application fields (such as pressure sensors) is also discussed. Secondly, it describes possible solutions for handling SENT communication on microcontrollers and it gives practical examples based on Infineon's TriCore and XC2000 families. It discusses the constraints and limitations on software level and how they could be solved by dedicated hardware implementations. Finally, this paper presents the Short PWM Code (SPC) protocol, which is a further extension of the SENT protocol. SPC aims at increasing the performance of the communication link and reducing system costs at the same time. By allowing bidirectional communication, SPC opens the way to new system relevant functionalities.

Fuel efficiency and clean combustion engine versus high engine performance - which will increase up to factor 10 in the next 5 years - with less engine displacement are driving more complex engine control systems in today's and future vehicles. The challenge is not only to design a perfect engine, but also to incorporate the right semiconductors. Beside this demand on high sophisticated electronics the demand on cost reduction - especially for small cars - is one driving factor for a smart partitioning. Infineon offers sensors, microcontrollers and power semiconductors for today's engine management platforms and therefore owns the right technologies to manufacture those devices. This opens up the possibility to integrate more functionality in less devices as in today's partitioning or to define electronics to simplify complex control strategies and to optimize the performance of each device.

The number of safety critical automotive applications employing high current brushless motors continues to increase (Steering, Braking, and Transmission etc.). There are many benefits when moving from traditional solutions to electrically actuated solutions. Some of these benefits can include increased fuel economy, simplified vehicle installation and packaging, increased feature set, improved safety and/or convenience, simplified unit assembly and modular testability prior as well as during vehicle manufacturing. The trend to implement brushless motors in these applications (which require electronically controlled commutation) has also brought with it the need for powerful inverters, which primarily consist of Power MOSFETs and MOSFET Driver ICs. This paper reviews the challenges associated with the design of safety critical electronic systems which combine sensing, control and actuation.

Functional safe systems fulfilling the ISO 26262 standard are getting more important for automotive applications where additional redundant and diverse functionality is needed for higher rated ASIL levels. This can result in a very complex and expensive system setup. Here we present a sensor product developed according ISO 26262. This sensor product comprises a two channel redundant and also diverse implemented magnetic field sensor concept with linear digital outputs on one monolithically integrated silicon substrate. This sensor is used for ASIL D applications like power-steering torque measurement, where the torque is transferred into a magnetic field signal in a certain magnetic setup, but can also be used in other demanding sensor applications concerning safety. This proposed and also implemented solution is beneficial because of implementation on a single chip in one single chip-package but anyway fulfilling ASIL D requirements on system level.

This paper will give an overview of multicore in automotive applications, covering the trends, benefits, challenges, and implementation scenarios. The automotive silicon industry has been building multicore and multiprocessor systems for a long time. The reasons for this choice have been: increased performance, safety redundancy, increased I/O & peripheral, access to multiple architectures (performance type e.g. DSP) and technologies. In the past, multiprocessors have been mainly considered as multi-die, multi-package with simple interconnection such as serial or parallel busses with possible shared memories. The new challenge is to implement a multicore, micro-processor that combines two or more independent processors into a single package, often a single integrated circuit (IC). The multicores allow a computing device to exhibit some form of thread-level parallelism (TLP).

In modern vehicles, the number of small electrical drive systems is still increasing continuously for blowers, fans and pumps as well as for window lifts, sunroofs and doors. Requirements and operating conditions for such systems varies, hence there are many different solutions available for controlling such motors. In most applications, simple, low-cost DC motors are used. For higher requirements regarding operating time and in stop-start capable systems, the focus turns to highly efficient and durable brushless DC motors with electronic commutation. This paper compares various electronic control concepts from a semiconductor vendor point of view. These concepts include discrete control using relays or MOSFETs. Furthermore integrated motor drivers are discussed, including system-on-chip solutions for specific applications, e.g. specific ICs for window lift motors with LIN interface.

The number of vehicles in world has been steadily increasing over the years. Asia Pacific is blessed to have the fastest growth rate in the world, with China experiencing over 20% vehicle production growth in the recent and coming years. As India jumps on this explosive bandwagon which could see growth rates higher than China, there is a need to understand the environmental and cost aspects arising from the vast increase of automobiles. The need to protect the environment, combined with the limited resource of oil, has led to the need for more fuel-efficient vehicles with intelligent engine and transmission control systems. This paper/presentation will look into the tough emissions regulations, lower CO2 requirement, different fuels and their efficiency, alternative fuel and the infrastructure to support such a paradigm shift, cost to achieve the desired, and GEMS-K1 (Gasoline Engine Management System - Kit 1) as a solution to meet some of the issues mentioned.

Increasingly stringent requirements to improve fuel economy and reduce emissions are pushing the automotive industry toward more innovative solutions. To fulfill the demand, OEMs are developing hybrid systems with powerful electronics. The key technology is in all cases the battery. It is the most critical and expensive element of hybrid systems. The battery requires special care, as it must supply up to 400 Volts (V) and have a capacity of up to several kilowatt-hours (kWh). This paper will review the main functions of a Lithium-ion (Li-ion) battery management system, including power on/off, charging/discharging, and computation of the state of charge and state of health. In order to increase the battery lifespan, new functions such as active load balancing must be implemented.

Based on the example of a door soft close automatic the potential of integrated system simulation in the automotive systems development is demonstrated. The modeling approach is covering several physical domains like mechanics, electromagnetics and semiconductor physics. With adequate simplifying methods a time efficient model is generated, which allows system optimization in the concept phase. Time consuming redesigns can thus be minimized.

More and more passenger cars are equipped with passive side protection systems such as thorax airbags for front and rear passengers. In the past, side airbag protection systems used sensors based on acceleration measurements [1]. In the meantime different sensor principles have been tested in order to increase the performance of this application. The intention has been to achieve faster firing decisions and to decrease the misuse risk for a floor or chassis impact. This paper presents the partitioning of an advanced chipset for pressure and acceleration based airbag systems. It shows the communication link between the sensors, the receiver-IC and other blocks in the application.

The electrification of the powertrain is still one of the main challenges and innovation drivers for modern cars. With the introduction of the Toyota Prius, launched in Japan in 1997 the first commercially available hybrid car in mass production, the development continued towards the BMW i3 launched in July 2013. One main component for all kind of hybrid cars is still the power semiconductor, which is used for DC/DC converters and for the inverter to drive the electric motor for the traction control. What makes the selection of the right power semiconductor complex, is the variety of different voltage levels within the car (from standard 12V board net, the new 48V board net all the way up to 400V and above) plus different requirements in terms of switching and conduction performance, or accordingly power losses. The selection of device by application and voltage will be discussed in this paper.

Autonomous driving systems and connected mobility are the next big developments for the car manufacturers and their suppliers during the next decade. To achieve the high computing power needs and fulfill new upcoming requirements due to functional safety and security, heterogeneous processor architectures with a mixture of different core architectures and hardware accelerators are necessary. To tackle this new type of hardware complexity and nevertheless stay within monetary constraints, high performance computers, inspired by state of the art data center hardware, could be adapted in order to fulfill automotive quality requirements. The European Processor Initiative (EPI) research project tries to come along with that challenge for next generation semiconductors. To be as close as possible to series development needs for the next upcoming car generations, we present a hybrid semiconductor system-on-chip architecture for automotive.

Introduction The introduction of Ethernet and Gigabit Ethernet [2] as the main invehicle network infrastructure is the technical foundation for different new functionalities such as piloted driving, minimizing the CO2- footprint and others. The high data rate of such systems influences also the used microcontrollers due the fact that a big amount of data has to be transferred, encrypted, etc. Figure 1 Motivation - Vehicles will become connected to uncontrolled networks The usage of Ethernet as the in-vehicle-network enables the possibility that future road vehicles are going to be connected with other vehicles and information systems to improve system functionality. These previously closed automotive systems will be opened up for external access (see Figure 1). This can be Car2X connectivity or connection to personal devices. Allowing vehicle systems to communicate with other systems that are not within their physical boundaries impose a previously non-existing security problem.