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Technical Paper

X-by-Wire: Opportunities, Challenges and Trends

2003-03-03
2003-01-0113
This paper will outline the results of a study performed to analyze the market introduction of x-by-wire applications in the context of weak global industry environment, technological and legislative challenges, standardization issues and end customer benefits. This paper attempts to provide a bird-view on influence factors and impacts for the x-by-wire market, including e.g. the end customer's acceptance and legal environment driving further development in specific areas. Further, major driving forces on semiconductor/component level will be outlined regarding e.g. pin-count, computation performance and heat dissipation, but also possible scenarios and solutions towards safe and efficient system design and partitioning.
Video

Supplier Discussions - 2012

2012-03-29
Seven different suppliers will discuss their latest technologies. Panelist Jon Bereisa, Auto Lectrification LLC John Burgers, Dana Canada Corporation Derek De Bono, Valeo Dusan Graovac, Infineon Technologies AG Ronald P. Krupitzer, American Iron and Steel Institute Timothy J. Lawler, Bosch Corp. Ian M. Sharp, Flybrid Systems LLP
Technical Paper

Redundant and Diverse Magnetic Field Digital Linear Hall Sensor Concept for ASIL D Applications

2017-03-28
2017-01-0053
Functional safe systems fulfilling the ISO 26262 standard are getting more important for automotive applications where additional redundant and diverse functionality is needed for higher rated ASIL levels. This can result in a very complex and expensive system setup. Here we present a sensor product developed according ISO 26262. This sensor product comprises a two channel redundant and also diverse implemented magnetic field sensor concept with linear digital outputs on one monolithically integrated silicon substrate. This sensor is used for ASIL D applications like power-steering torque measurement, where the torque is transferred into a magnetic field signal in a certain magnetic setup, but can also be used in other demanding sensor applications concerning safety. This proposed and also implemented solution is beneficial because of implementation on a single chip in one single chip-package but anyway fulfilling ASIL D requirements on system level.
Technical Paper

Motor Control in Auxiliary Drive Systems How to Choose the Best Fitting Electronic Solution

2014-04-01
2014-01-0323
In modern vehicles, the number of small electrical drive systems is still increasing continuously for blowers, fans and pumps as well as for window lifts, sunroofs and doors. Requirements and operating conditions for such systems varies, hence there are many different solutions available for controlling such motors. In most applications, simple, low-cost DC motors are used. For higher requirements regarding operating time and in stop-start capable systems, the focus turns to highly efficient and durable brushless DC motors with electronic commutation. This paper compares various electronic control concepts from a semiconductor vendor point of view. These concepts include discrete control using relays or MOSFETs. Furthermore integrated motor drivers are discussed, including system-on-chip solutions for specific applications, e.g. specific ICs for window lift motors with LIN interface.
Technical Paper

Integrated Mechatronic Design and Simulation of a Door Soft Close Automatic with Behavioral Models of Smart Power ICs

2002-03-04
2002-01-0564
Based on the example of a door soft close automatic the potential of integrated system simulation in the automotive systems development is demonstrated. The modeling approach is covering several physical domains like mechanics, electromagnetics and semiconductor physics. With adequate simplifying methods a time efficient model is generated, which allows system optimization in the concept phase. Time consuming redesigns can thus be minimized.
Technical Paper

Hybrid Cars Setting New Challenges for Optimized Power Semiconductors

2014-04-01
2014-01-0242
The electrification of the powertrain is still one of the main challenges and innovation drivers for modern cars. With the introduction of the Toyota Prius, launched in Japan in 1997 the first commercially available hybrid car in mass production, the development continued towards the BMW i3 launched in July 2013. One main component for all kind of hybrid cars is still the power semiconductor, which is used for DC/DC converters and for the inverter to drive the electric motor for the traction control. What makes the selection of the right power semiconductor complex, is the variety of different voltage levels within the car (from standard 12V board net, the new 48V board net all the way up to 400V and above) plus different requirements in terms of switching and conduction performance, or accordingly power losses. The selection of device by application and voltage will be discussed in this paper.
Technical Paper

High Performance Processor Architecture for Automotive Large Scaled Integrated Systems within the European Processor Initiative Research Project

2019-04-02
2019-01-0118
Autonomous driving systems and connected mobility are the next big developments for the car manufacturers and their suppliers during the next decade. To achieve the high computing power needs and fulfill new upcoming requirements due to functional safety and security, heterogeneous processor architectures with a mixture of different core architectures and hardware accelerators are necessary. To tackle this new type of hardware complexity and nevertheless stay within monetary constraints, high performance computers, inspired by state of the art data center hardware, could be adapted in order to fulfill automotive quality requirements. The European Processor Initiative (EPI) research project tries to come along with that challenge for next generation semiconductors. To be as close as possible to series development needs for the next upcoming car generations, we present a hybrid semiconductor system-on-chip architecture for automotive.
Technical Paper

Hardware and Software Constraints for Automotive Firewall Systems?

2016-04-05
2016-01-0063
Introduction The introduction of Ethernet and Gigabit Ethernet [2] as the main invehicle network infrastructure is the technical foundation for different new functionalities such as piloted driving, minimizing the CO2- footprint and others. The high data rate of such systems influences also the used microcontrollers due the fact that a big amount of data has to be transferred, encrypted, etc. Figure 1 Motivation - Vehicles will become connected to uncontrolled networks The usage of Ethernet as the in-vehicle-network enables the possibility that future road vehicles are going to be connected with other vehicles and information systems to improve system functionality. These previously closed automotive systems will be opened up for external access (see Figure 1). This can be Car2X connectivity or connection to personal devices. Allowing vehicle systems to communicate with other systems that are not within their physical boundaries impose a previously non-existing security problem.
Technical Paper

Giant Magneto Resistors - Sensor Technology and Automotive Applications

2005-04-11
2005-01-0462
The paper will give an introduction to the principle of the giant magneto resistive - GMR - effect and the silicon system integration of GMR sensors. The two main applications of a GMR as a magnetic field strength sensor and as an angular field direction sensor will be discussed under consideration of automotive requirements. The typical applications of a magnetic field strength GMR sensor in incremental position and speed sensing and those of GMR angular field sensors in position sensing will be summarized. Finally advantages of GMR in those applications will be discussed and conclusions on the use of GMR in automotive sensing will be drawn.
Technical Paper

Design Considerations for Power Electronics in HEV Applications

2007-04-16
2007-01-0277
Today the majority of power electronics is developed based on the requirements set by the main fields of application e.g. power generation, power supply, industrial drive and traction. With introduction to automotive applications new requirements have to be taken into account. This paper discusses how interconnection technologies for power semiconductors can be improved to meet the demand for higher temperature capability in HEV applications.
Technical Paper

Cost Efficient Integration for Decentralized Automotive ECU

2004-03-08
2004-01-0717
As the demand for enhanced comfort, safety and differentiation with new features continues to grow and as electronics and software enable most of these, the number of electronic units or components within automobiles will continue to increase. This will increase the overall system complexity, specifically with respect to the number of controller actuators such as e-motors. However, hard constraints on cost and on physical boundaries such as maximum power dissipation per unit and pin-count per unit/connector require new solutions to alternative system partitioning. Vehicle manufacturers, as well as system and semiconductor suppliers are striving for increased scalability and modularity to allow for most cost optimal high volume configurations while featuring platform reuse and feature differentiation. This paper presents new semiconductor based approaches with respect to technologies, technology mapping and assembly technologies.
Technical Paper

Automotive ADAS Camera System Configuration Using Multi-Core Microcontroller

2015-03-10
2015-01-0023
It has become an important trend to implement safety-related requirements in the road vehicles. Recent studies have shown that accidents, which occurred when drivers are not focused due to fatigue or distractions, can be predicted in advance when using safety features. Advanced Driver Assistance Systems (ADAS) are used to prevent this kind of situation. Currently, many major tiers are using a DSP chip for ADAS applications. This paper suggests the migration from a DSP configuration to a Microcontroller configuration for ADAS application, for example, using a 32bit Multi-core Microcontroller. In this paper, the following topics will be discussed. Firstly, this paper proposes and describes the system block diagram for ADAS configuration followed by the requirements of the ADAS system. Secondly, the paper discusses the current solutions using a DSP. Thirdly, the paper presents a system that is migrated to a Multi-core microcontroller.
Technical Paper

AUDO Architecture A Solution to Automotive Micro-Controller Requirements

2000-03-06
2000-01-0145
The C166 family, based on a 16-bit core; it is nowadays an enormous success in automotive, in particular in PowerTrain. This component is the right answer for the automotive real time applications of today. It is with both, automotive customer requirements and a long automotive experience in semi-conductors that this new generation 32-bit family is borne. The objective of this document is to provide and comment on automotive requirements in terms of the new micro-controller, to show the benefits for the applications and explain how the AUDO architecture fulfils these requirements.
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