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In the last two decades, an aerospace industry trend in the secondary power distribution concept has been dominated by power electronics technology which includes power converters and Power Control Modules based on Solid State Power Control (SSPC) switching elements. These Power Control Modules, grouped around microprocessor based controllers and combined in a single electronic chassis, have become a backbone of electrical power distribution systems on all major commercial and military transport aircraft. Due to the resistive properties of the semiconductor-based SSPC devices, whose behaviors can be described as nonlinear functions of ambient operating temperature, power distribution system integration with SSPCs is challenged and heavily affected by operating temperatures and power dissipation limits. Although aircraft compartments where Power Control Modules are located are considered temperature and pressure controlled, high ambient operating temperatures are possible and expected.