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Standard

Syntactic Foam Tiles

2016-11-10
CURRENT
AMS3709D
This specification covers dielectrically-loaded syntactic foam tiles having a polyimide resin matrix.
Standard

Surface Preparation and Priming of Aluminum Alloy Parts for High Durability Structural Adhesive Bonding

2018-11-15
WIP
ARP1524B
This Aerospace Recommended Practice (ARP) describes the processing system and techniques for the surface preparation and priming of aluminum alloy parts for structural adhesive bonding to achieve optimum bondline durability, corrosion resistance, and manufacturing producibility. While this surface preparation has been developed and validated for two high strength aluminum alloys, 2024 and 7075, in the hardened condition it is expected to be applicable to other alloys and tempers. This surface preparation system has been validated for use with 180 degrees F (82 degrees C) and with 250 degrees F (121 degrees C) curing elastomer-modified epoxy adhesive and corrosion-inhibiting primer. The processes described herein are the result of laboratory evaluation of structural and durability performance.
Standard

Structural Weldbonding of Aluminum Structures

1990-10-01
CURRENT
ARP1675
This SAE Aerospace Recommended Practice describes the aluminum weldbonding process for fabrication of secondary aircraft structural assemblies possessing excellent strength, fatigue life, and environmental durability.
Standard

Radome, Foam Sandwich Hot-Melt, Addition-Type Polyimide

1994-06-01
CURRENT
AMS3913B
This specification covers the material and process requirements for fabricating sandwich radomes having hot-melt, addition-reaction polyimide-resin-impregnated quartz cloth shells and polyimide-resin syntactic foam cores.
Standard

Polyimide Printed Circuit Boards Fabrication of

1990-01-01
CURRENT
ARP1612A
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.
Standard

Physical-Chemical Characterization Techniques, Epoxy Adhesive and Prepreg Resin Systems

1985-04-01
CURRENT
ARP1610A
This recommended practice describes the physical and chemical characterization techniques for identification of epoxy adhesive and prepreg resin systems in order to verify the chemical formulation, resin B-staging (See 8.1), cure reaction rates, adhesive moisture content, and resin component mix ratios, as necessary to achieve manufacturing and quality producibility and engineering performance.
Standard

Mold Release Agent

1993-10-01
CURRENT
AMS3091C
This specification covers a mold release agent in the form of a liquid.
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