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Standard

Polyimide Printed Circuit Boards Fabrication of

1990-01-01
CURRENT
ARP1612A
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.
Standard

Adhesive, Film Form Metallic Structural Sandwich Construction

1999-08-01
CURRENT
AMSA25463
This specification covers the requirements for adhesives in film form for bonding metal facings to metal cores and to metal components of sandwich panels which are intended for use in primary and secondary structural airframe parts that may be exposed to temperatures up to 500°F (260°C).
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