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Standard

Syntactic Foam Tiles

2016-11-10
CURRENT
AMS3709D
This specification covers dielectrically-loaded syntactic foam tiles having a polyimide resin matrix.
Standard

Surface Preparation and Priming of Aluminum Alloy Parts for High Durability Structural Adhesive Bonding

2018-11-15
WIP
ARP1524B
This Aerospace Recommended Practice (ARP) describes the processing system and techniques for the surface preparation and priming of aluminum alloy parts for structural adhesive bonding to achieve optimum bondline durability, corrosion resistance, and manufacturing producibility. While this surface preparation has been developed and validated for two high strength aluminum alloys, 2024 and 7075, in the hardened condition it is expected to be applicable to other alloys and tempers. This surface preparation system has been validated for use with 180 degrees F (82 degrees C) and with 250 degrees F (121 degrees C) curing elastomer-modified epoxy adhesive and corrosion-inhibiting primer. The processes described herein are the result of laboratory evaluation of structural and durability performance.
Standard

Structural Weldbonding of Aluminum Structures

2014-08-14
CURRENT
ARP1675
This SAE Aerospace Recommended Practice describes the aluminum weldbonding process for fabrication of secondary aircraft structural assemblies possessing excellent strength, fatigue life, and environmental durability.
Standard

Roving, Type "S-2" Glass Epoxy Resin Impregnated

2016-12-16
CURRENT
AMS3832D
This specification covers continuous, multiple-strand, roving of Type "S-2" glass impregnated with a heat-curable epoxy resin matrix and processed to a "B" stage condition.
Standard

ROVING, TYPE "S-2" GLASS Epoxy Resin Impregnated

1994-05-01
HISTORICAL
AMS3832C
This specification covers continuous, multiple-strand, roving of Type "S-2" glass impregnated with a heat-curable epoxy resin matrix and processed to a "B" stage condition.
Standard

Polyimide Printed Circuit Boards Fabrication of

2022-06-05
CURRENT
ARP1612A
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.
Standard

Mold Release Agent

2022-10-04
CURRENT
AMS3091C
This specification covers a mold release agent in the form of a liquid.
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