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Standard

Terminus, Fiber Optic, Harsh Environment, General Specification

2021-11-23
CURRENT
AS8438
This document provides details of test methods that should be taken into consideration when qualifying fiber optic termini to the product specifications (slash sheets). The product specifications (slash sheets) provide pass/fail criteria, optical and physical intermatability, and interoperability requirements for fiber optic termini in circular, rectangular, and modular type aerospace connectors.
Standard

Splicer, Fusion, Fiber Optic, Aerospace, Explosion-Proof (Type I)

2020-01-30
CURRENT
AS6479/1
This detail specification defines fiber optic fusion splicers acceptable for the installation and repair of a wide range of optical fibers and cables with virtually no insertion loss in hazardous environments (potentially flammable or explosive atmospheres, Type I), particularly aerospace applications. The requirements for acquiring the splicer described herein shall consist of this specification and the latest issue of AS6479.
Standard

Splicer, Fusion, Fiber Optic, Aerospace Non-Explosion-Proof (Type II)

2020-01-30
CURRENT
AS6479/2
This detail specification defines fiber optic fusion splicers acceptable for the installation and repair of a wide range of optical fibers and cables with virtually no insertion loss, particularly in aerospace applications, but not in flammable or explosive atmospheres (Type II). The requirements for acquiring the splicer described herein shall consist of this specification and the latest issue of AS6479.
Standard

Reliability Assurance of Photonic Integrated Circuit (PIC) Based Devices Used in Aerospace Applications

2019-10-24
WIP
ARP6676
This document is intended to provide reliability assurance recommended practices for the deployment of individual photonic devices and PIC-based devices into aerospace platforms, focusing on reliability requirements to reach Technology Readiness Level (TRL) 7, 8 and 9. It will cover reliability assurance tests for single element and PIC chips, packaged single element and PIC chips and some single element and PIC based higher functionality modules, such as fiber-optic transmitters and receivers, free space optical transmitters and receivers, illuminators and sources for optical sensors. The document will provide the reasons and methods for aerospace reliability assurance of PIC chips, PIC based packages and PIC based devices. It will be as inclusive as possible, including PIC chips fabricated in the main material systems: semiconductors (Group IV, III-V, II-VI), electro-optic crystals (lithium niobate) and polymers.
Standard

High Performance Epoxies for Aerospace Applications

2018-10-18
WIP
AS8449
The goal of this document would be to control specific configurations of epoxies approved for aerospace. Providing a structured standard for configuration control of epoxies and appropriate applications and areas of use for multiple grades and environmental performance considerations.
Standard

Guidelines for Design of Digital Fiber Optic Link Loss Budget Methodology

2018-01-23
CURRENT
AIR6113
This document draws from, summarizes, and explains existing broadly accepted engineering best practices. This document defines the process and procedure for application of various best practice methods. This document is specifically intended as a standard for the engineering practice of development and execution of a link loss power budget for a general aerospace system related digital fiber optic link. It is not intended to specify the values associated with specific categories or implementations of digital fiber optic links. This document is intended to address both existing digital fiber optic link technology and accommodate new and emerging technologies. The proper application of various calculation methods is provided to determine link loss power budget(s), that depend on differing requirements on aerospace programs.
Standard

Fusion Splice for Aerospace Fiber Optic Cables

2021-07-23
CURRENT
AS6506/1
This specification includes detailed requirements for a fiber optic cable splice compliant with AS6506. Every requirement of the parent standard, AS6506, which applies to this detail specification is identified below by the word “applicable.” In any case in which a requirement of this specification varies from that of the parent standard, the alternate requirement is described. If a parent standard requirement does not apply, the words used are “not applicable.”
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