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This SAE Aerospace Standard (AS) standardizes inspection and test procedures, workmanship criteria, and minimum training and certification requirements to detect Suspect/Counterfeit (SC) Electrical, Electronic, and Electromechanical (EEE) parts. The requirements of this document apply once a decision is made to use parts with unknown chain of custody that do not have pedigree back to the original component manufacturer or have been acquired from a broker or independent distributor, or when there are other known risk elements that result in the User/Requester to have concerns about potential SC EEE parts. The tests specified by this standard may also detect occurrences of malicious tampering, although the current version of this standard is not designed specifically for this purpose. This standard ensures consistency across the supply chain for test techniques and requirements based on assessed risk associated with the application, component, supplier, and other relevant risk factors.

This SAE Aerospace Standard (AS) standardizes inspection and test procedures, workmanship criteria, and minimum training and certification requirements to detect Suspect/Counterfeit (SC) Electrical, Electronic, and Electromechanical (EEE) parts. The requirements of this document apply once a decision is made to use parts with unknown chain of custody that do not have pedigree back to the original component manufacturer or have been acquired from a broker or independent distributor, or when there are other known risk elements that result in the User/Requester to have concerns about potential SC EEE parts. The tests specified by this standard may also detect occurrences of malicious tampering, although the current version of this standard is not designed specifically for this purpose. This standard ensures consistency across the supply chain for test techniques and requirements based on assessed risk associated with the application, component, supplier, and other relevant risk factors.

This SAE Aerospace Standard (AS) standardizes inspection and test procedures, workmanship criteria, and minimum training and certification requirements to detect Suspect/Counterfeit (SC) Electrical, Electronic, and Electromechanical (EEE) parts. The requirements of this document apply once a decision is made to use parts with unknown chain of custody that do not have pedigree back to the original component manufacturer, or have been acquired from a broker or independent distributor, or when there are other known risk elements that result in the User/Requester to have concerns about potential SC EEE parts. The tests specified by this standard may also detect occurrences of malicious tampering, although the current version of this standard is not designed specifically for this purpose. This standard ensures consistency across the supply chain for test techniques and requirements based on assessed risk associated with the application, component, supplier, and other relevant risk factors.

XRF technique for counterfeit detection is applicable to electrical, electronic and electromechanical (EEE) parts as listed in AS6171 General Requirements. In general, the detection technique is meant for use on piece parts prior to assembly on a circuit board or on the parts that are removed from a circuit board. The applicability spans a large swath of active, passive and electromechanical parts. If AS6171/3 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.

This test method provides the capabilities, limitations, and suggested possible applications of TGA as it pertains to the detection of counterfeit electronic components. Additionally, this document outlines requirements associated with the application of TGA including: equipment requirements, test sample requirements, methodology, control and calibration, data analysis, reporting, and qualification and certification. If AS6171/10 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.

To define capabilities and limitations of Raman spectroscopy as it pertains to counterfeit detection of EEE parts and suggest possible applications to these ends. Additionally, this document outlines requirements associated with the application of Raman spectroscopy including: Operator training; Sample preparation; Data interpretation; Computerized spectral matching including pass/fail criteria; Equipment maintenance and; Reporting of data. If AS6171/8 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.

The intent of this document is to define the methodology for suspect parts inspection using radiological inspection. The purpose of radiology for suspect counterfeit part inspection is to detect deliberate misrepresentation of a part, either at the part distributor or original equipment manufacturer (OEM) level. Radiological inspection can also potentially detect unintentional damage to the part resulting from improper removal of part from assemblies, which may include, but not limited to, prolonged elevated temperature exposure during desoldering operations or mechanical stresses during removal. Radiological inspection of electronics includes film radiography and filmless radiography such as digital radiography (DR), real time radiography (RTR), and computed tomography (CT). Radiology is an important tool used in part verification of microelectronic devices.

This document contains a list of EVI tests that can be specified by the Requester to detect Suspect/Counterfeit EEE Parts. The following EVI tests described in this document are listed in 3.4 of AS6171 General Requirements: Method A: General EVI Method B: Detailed EVI, including Part Weight Measurement Method C: Testing for Remarking Method D: Testing for Resurfacing Method E: Part Dimensions Measurement When the SOW or the PO includes Part Packaging test(s) (refer to AS6171/15), the Responsible Test Laboratory (RTL) shall ensure that the Part Packaging test(s) are completed prior to starting the EVI test(s). This document is focused on EEE parts (herein may be referred to as “EEE parts” or “parts”). Although the examples in this document focus on microcircuits, this document applies to all EEE parts listed in the Applicability Matrix (Appendix A of AS6171 General Requirements).

This document defines capabilities and limitations of FTIR spectroscopy as it pertains to counterfeit electronic component detection and suggests possible applications to these ends. Additionally, this document outlines requirements associated with the application of FTIR spectroscopy including: operator training, sample preparation, various sampling techniques, data interpretation, computerized spectral matching including pass/fail criteria, equipment maintenance, and reporting of data. The discussion is primarily aimed at analyses performed in the mid-infrared (IR) from 400 to 4000 wavenumbers; however, many of the concepts are applicable to the near and far IR. If AS6171/9 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.

This document describes the requirements of the following test methods for counterfeit detection of electronic components: a Method A: General EVI, Sample Selection, and Handling b Method B: Detailed EVI, including Part Weight measurement c Method C: Testing for Remarking d Method D: Testing for Resurfacing e Method E: Part Dimensions measurement f Method F: Surface Texture Analysis using SEM The scope of this document is focused on leaded electronic components, microcircuits, multi-chip modules (MCMs), and hybrids. Other EEE components may require evaluations not specified in this procedure. Where applicable this document can be used as a guide. Additional inspections or criteria would need to be developed and documented to thoroughly evaluate these additional part types. If AS6171/2 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.

This document describes the requirements of the following test methods for counterfeit detection of electronic components: a Method A: General External Visual Inspection (EVI), Sample Selection, and Handling b Method B: Detailed EVI c Method C: Testing for Remarking and Resurfacing d Method D: Surface Texture Analysis by SEM NOTE: The scope of this document was focused on leaded electronic components, microcircuits, multi-chip modules (MCMs), and hybrids. Other electronic components may require evaluations not specified in this procedure. Where applicable this document can be used as a guide but additional inspections or criteria would need to be developed and documented to thoroughly evaluate these additional part types.

The scope of this document is to: 1 Specify techniques to detect SC parts using electrical testing. 2 Provide various levels of electrical testing that can be used by the User to define test plans for detecting SC parts. 3 Provide minimum requirements for testing laboratories so that User/Requester can determine which test houses have the necessary capabilities. (For example: technical knowledge, equipment, procedures and protocols for performing electrical testing for verification analysis.) Note: User/Requester is defined in AS6171 General Requirements 4 Specify Burn-In and environmental tests. The environmental tests include Temperature Cycling for Active Devices and Thermal Shock for Passive Devices. Seal Tests are described and recommended for hermetic devices. The following terminology is used throughout this document: a Shall = is mandatory; b Should = is recommended; and c Will = is planned (is considered to be part of a standard process).

This method outlines the requirements, capabilities, and limitations associated with the application of Design Recovery for the detection of counterfeit electronic parts including: Operator training; Sample preparation; Imaging techniques; Data interpretation; Design/functional matching; Equipment maintenance and; Reporting of data. The method is primarily aimed at analyses performed by circuit delayering and imaging with a scanning electron microscope or optical microscope; however, many of the concepts are applicable to other microscope and probing techniques to recover design data. The method is not intended for the purpose of manufacturing copies of a device, but rather to compare images or recover the design for determination of authenticity. If AS6171/11 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.

This method outlines the requirements, capabilities, and limitations associated with the application of Design Recovery for the detection of counterfeit electronic parts including: Operator training; Sample preparation; Imaging techniques; Data interpretation; Design/functional matching; Equipment maintenance and; Reporting of data. The method is primarily aimed at analyses performed by circuit delayering and imaging with a scanning electron microscope or optical microscope; however, many of the concepts are applicable to other microscope and probing techniques to recover design data. The method is not intended for the purpose of manufacturing copies of a device, but rather to compare images or recover the design for determination of authenticity. If AS6171/11 is invoked in the contract, the base document, AS6171 General Requirements shall also apply. SAE Counterfeit Defect Coverage Tool

This method standardizes inspection, test procedures and minimum training and certification requirements to detect Suspect/Counterfeit (SC) Electrical, Electronic, and Electromechanical (EEE) components or parts utilizing Delid/Decapsulation Physical Analysis. The methods described in this document are employed to either delid or remove the cover from a hermetically sealed package or to remove the encapsulation or coating of an EEE part, in order to examine the internal structure and to determine if the part is suspect counterfeit. Information obtained from this inspection and analysis may be used to: a. prevent inclusion of counterfeit parts in the assembly b. identify defective parts c. aid in disposition of parts that exhibit anomalies This test method should not be confused with Destructive Physical Analysis as defined in MIL-STD-1580. MIL-STD-1580 describes destructive physical analysis procedures for inspection and interpretation of quality issues.

This method standardizes inspection, test procedures and minimum training and certification requirements to detect Suspect/Counterfeit (SC) Electrical, Electronic, and Electromechanical (EEE) components or parts utilizing Delid/Decapsulation Physical Analysis. The methods described in this document are employed to either delid or remove the cover from a hermetically sealed package or to remove the encapsulation or coating of an EEE part, in order to examine the internal structure and to determine if the part is suspect counterfeit. Information obtained from this inspection and analysis may be used to: a prevent inclusion of counterfeit parts in the assembly b identify defective parts c aid in disposition of parts that exhibit anomalies This test method should not be confused with Destructive Physical Analysis as defined in MIL-STD-1580. MIL-STD-1580 describes destructive physical analysis procedures for inspection and interpretation of quality issues.

Through the use of ultra-high frequency ultrasound, typically above 10 MHz, Acoustic Microscopy (AM) non-destructively finds and characterizes physical features and latent defects (visualization of interior features in a layer by layer process) - such as material continuity and discontinuities, sub-surface flaws, cracks, voids, delaminations and porosity. AM observed features and defects can be indicators that the components were improperly handled, stored, altered or previously used. If AS6171/6 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.

Through the use of ultra-high frequency ultrasound, typically above 10 MHz, Acoustic Microscopy (AM) non-destructively finds and characterizes physical features and latent defects (visualization of interior features in a layer by layer process) - such as material continuity and discontinuities, sub-surface flaws, cracks, voids, delaminations and porosity. AM observed features and defects can be indicators that the components were improperly handled, stored, altered or previously used. If AS6171/6 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.

This document describes an assessment of the effectiveness of a specified test plan used to screen for counterfeit parts. The assessment includes the determination of the types of defects detected using a specified test plan along with the related counterfeit type coverage. The output of this evaluation will produce Counterfeit Defect Coverage (CDC), Counterfeit Type Coverage (CTC), Not-Covered Defects (NCDs), and Under-Covered Defects (UCDs). This information will be supplied to the test laboratory’s customer in both the test report and the Certificate of Quality Conformance (CoQC). This evaluation method does not address the effectiveness of detecting tampered type devices. The Test Evaluation Method also describes an Optimized Test Sequence Selection, in which a test sequence is selected that maximizes the CDC utilizing test cost and time as constraints, for any tier level except the Critical Risk Level. The constraints can be adjusted until the desired CDC is achieved.

This document describes an assessment of the effectiveness of a specified test plan used to screen for counterfeit parts. The assessment includes the determination of the types of defects detected using a specified test plan along with the related counterfeit type coverage. The output of this evaluation will produce Counterfeit Defect Coverage (CDC), Counterfeit Type Coverage (CTC), Not-Covered Defects (NCDs), and Under-Covered Defects (UCDs). This information will be supplied to the test laboratory’s customer in both the test report and the Certificate of Quality Conformance (CoQC). This evaluation method does not address the effectiveness of detecting tampered type devices. The Test Evaluation Method also describes an Optimized Test Sequence Selection, in which a test sequence is selected that maximizes the CDC utilizing test cost and time as constraints, for any tier level except the Critical Risk Level. The constraints can be adjusted until the desired CDC is achieved.