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Standard

Primer, Adhesive, Electrodeposited -55 to +82 °C (-67 to +180 °F)

2022-08-10

CURRENT

AMS3109

This specification covers a corrosion-inhibiting, water soluble, modified epoxy primer in liquid form.

Standard

Polyimide Printed Circuit Boards Fabrication of

2022-06-05

CURRENT

ARP1612A

This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.

Standard

Core Material, Aluminum, For Sandwich Construction

2006-01-06

HISTORICAL

AMSC7438

This specification covers treated aluminum core material for structural sandwich construction.

Standard

Adhesive, Polyimide Resin, Film and Paste High Temperature Resistant, 315 °C (599 °F)

2022-01-20

CURRENT

AMS3686A

This specification covers a high-temperature, electrical grade, polyimide resin adhesive in the form of film or paste.

Standard

Adhesive, Foaming, Honeycomb, Core Splice, Structural −54 to +177 °C (−65 to +350 °F)

2022-08-10

CURRENT

AMS3689B

This specification covers a foaming-type, heat-curing, resin-base adhesive in the form of paste or sheet.

Standard

ADHESIVE, EPOXY PASTE, FOR STRUCTURAL WELDBOND For 80°C (180°F) Service

1995-10-01

HISTORICAL

AMS3708

This specification covers a one-part modified epoxy adhesive in the form of paste.