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The intent of this document is to define the methodology for suspect parts inspection using radiological inspection. The purpose of radiology for suspect counterfeit part inspection is to detect deliberate misrepresentation of a part, either at the part distributor or original equipment manufacturer (OEM) level. Radiological inspection can also potentially detect unintentional damage to the part resulting from improper removal of part from assemblies, which may include, but not limited to, prolonged elevated temperature exposure during desoldering operations or mechanical stresses during removal. Radiological inspection of electronics includes film radiography and filmless radiography such as digital radiography (DR), real time radiography (RTR), and computed tomography (CT). Radiology is an important tool used in part verification of microelectronic devices.

This document contains a list of EVI tests that can be specified by the Requester to detect Suspect/Counterfeit EEE Parts. The following EVI tests described in this document are listed in 3.4 of AS6171 General Requirements: Method A: General EVI Method B: Detailed EVI, including Part Weight Measurement Method C: Testing for Remarking Method D: Testing for Resurfacing Method E: Part Dimensions Measurement When the SOW or the PO includes Part Packaging test(s) (refer to AS6171/15), the Responsible Test Laboratory (RTL) shall ensure that the Part Packaging test(s) are completed prior to starting the EVI test(s). This document is focused on EEE parts (herein may be referred to as “EEE parts” or “parts”). Although the examples in this document focus on microcircuits, this document applies to all EEE parts listed in the Applicability Matrix (Appendix A of AS6171 General Requirements).

This document describes the requirements of the following test methods for counterfeit detection of electronic components: a Method A: General EVI, Sample Selection, and Handling b Method B: Detailed EVI, including Part Weight measurement c Method C: Testing for Remarking d Method D: Testing for Resurfacing e Method E: Part Dimensions measurement f Method F: Surface Texture Analysis using SEM The scope of this document is focused on leaded electronic components, microcircuits, multi-chip modules (MCMs), and hybrids. Other EEE components may require evaluations not specified in this procedure. Where applicable this document can be used as a guide. Additional inspections or criteria would need to be developed and documented to thoroughly evaluate these additional part types. If AS6171/2 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.

This document describes the requirements of the following test methods for counterfeit detection of electronic components: a Method A: General External Visual Inspection (EVI), Sample Selection, and Handling b Method B: Detailed EVI c Method C: Testing for Remarking and Resurfacing d Method D: Surface Texture Analysis by SEM NOTE: The scope of this document was focused on leaded electronic components, microcircuits, multi-chip modules (MCMs), and hybrids. Other electronic components may require evaluations not specified in this procedure. Where applicable this document can be used as a guide but additional inspections or criteria would need to be developed and documented to thoroughly evaluate these additional part types.

The scope of this document is to: 1 Specify techniques to detect SC parts using electrical testing. 2 Provide various levels of electrical testing that can be used by the User to define test plans for detecting SC parts. 3 Provide minimum requirements for testing laboratories so that User/Requester can determine which test houses have the necessary capabilities. (For example: technical knowledge, equipment, procedures and protocols for performing electrical testing for verification analysis.) Note: User/Requester is defined in AS6171 General Requirements 4 Specify Burn-In and environmental tests. The environmental tests include Temperature Cycling for Active Devices and Thermal Shock for Passive Devices. Seal Tests are described and recommended for hermetic devices. The following terminology is used throughout this document: a Shall = is mandatory; b Should = is recommended; and c Will = is planned (is considered to be part of a standard process).

This method standardizes inspection, test procedures and minimum training and certification requirements to detect Suspect/Counterfeit (SC) Electrical, Electronic, and Electromechanical (EEE) components or parts utilizing Delid/Decapsulation Physical Analysis. The methods described in this document are employed to either delid or remove the cover from a hermetically sealed package or to remove the encapsulation or coating of an EEE part, in order to examine the internal structure and to determine if the part is suspect counterfeit. Information obtained from this inspection and analysis may be used to: a prevent inclusion of counterfeit parts in the assembly b identify defective parts c aid in disposition of parts that exhibit anomalies This test method should not be confused with Destructive Physical Analysis as defined in MIL-STD-1580. MIL-STD-1580 describes destructive physical analysis procedures for inspection and interpretation of quality issues.