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Enhanced SATCOMs for Unmanned Aerial Systems The Bus Too Tough to Die Combating Infrared Threats on the Battlefield Optical Interconnect Design Challenges in Space High-Performance Computing for the Next-Generation Combat Vehicle Merging Antenna and Electronics Boosts Energy and Spectrum Efficiency Integrated Magneto-Optical Devices for On-Chip Photonic Systems Development of magneto-optical (MO) materials could lead to a range of nonreciprocal optical devices for emerging standardized photonic integrated circuit (PIC) fabrication processes. Low Power Optical Phase Array Using Graphene on Silicon Photonics Electrostatic doping of 2D materials embedded in waveguides could enable ultrafast devices with unprecedented power. Spatial Resolution and Contrast of a Focused Diffractive Plenoptic Camera New technology captures spectral and spatial information of a scene in one snapshot while raising pixel counts and improving image quality.

Beyond VMEbus - A New Concept Taming the Thermal Behavior of Solid-State Military Lasers Solving the Challenge of Thermal Design in Aerospace Electronics Improving Component Life in Abrasive, Corrosive Aerospace Environments New Pulse Analysis Techniques for Radar and EW Validation of Ubiquitous 2D Radar Converting Existing Copper Wire Firing System to a Fiber-Optically Controlled Firing System for Electromagnetic Pulsed Power Experiments Technological improvements make pulsed-power experiments with gunpowder- or air-driven guns safer. Low-Cost Ground Sensor Network for Intrusion Detection COTS-based system could provide increased level of security with less manpower. In-Network Processing on Low-Cost IoT Nodes for Maritime Surveillance Commercially available system of distributed wireless sensors could increase the Navy's intelligence collection footprint.

Laser Detecting Systems Enhancing Survivability and Lethality on the Battlefield Designing With Plastics for Military Equipment Engine Air-Brakes Paving the Way to Quieter Aircraft Nett Warrior Enhancing Battlefield Connectivity and Communications XPONENTIAL 2018 - An AUVSI Experience Communications in Space: A Deep Subject First Air-Worthy Metal-Printed RF Filter Ready for Takeoff Validation of Automated Prediction of Blood Product Needs Algorithm Processing Continuous Non-Invasive Vital Signs Streams (ONPOINT4) Using a combination of non-invasive sensors, advanced algorithms, and instruments built for combat medics could reduce hemorrhaging and improve survival rates. Calculation of Weapon Platform Attitude and Cant Using Available Sensor Feedback Successful development of mobile weapon systems must incorporate operation on sloped terrain.

Engineering Events staff at SAE International in Warrendale, Pennsylvania, have extended the call for abstracts through September 21 for the organization’s AeroTech aerospace and defense technology conference, which will take place at the Fort Worth Convention Center in Fort Worth, Texas, March 14-16, 2023. Visit the AeroTech call for abstracts page for more information and to get started.

Quality management professionals across the global aerospace and defense community are convening for one hour – Wednesday, October 27th, starting at 10 am Pacific Daylight Time (PDT) – to discuss the AS9100 international standard. Register to take part in the free AeroTech webinar, hosted by SAE International and Tektronix, designed to help manufacturers, contractors, and subcontractors throughout the global aviation, space, and defense supply chain keep pace with and meet the requirements of AS9100 international quality management system standard.

Success in metal additive manufacturing (AM) relies on the optimization of a large set of process parameters to achieve materials whose properties and performance meet design and safety requirements. Despite continuous improvements in the process over the years, the quality of AM parts remains a major concern for manufacturers. Today, researchers are starting to move from discrete geometry-dependent build parameters to continuously variable or dynamically changing parameters that are geometry- and scan-path aware. This approach has become known as “feedforward control.” Process Control for Defect Mitigation in Laser Powder Bed Fusion Additive Manufacturing discusses the origins of feedforward control, its early implementations in AM, the current state of the art, and a path forward to its broader adoption. Click here to access the full SAE EDGETM Research Report portfolio.

This Aerospace Standard (AS) establishes the requirements for suppliers of Nonconventional Machining Services to be accredited by the National Aerospace and Defense Contractors Accreditation Program (NADCAP). NADCAP accreditation is granted in accordance with SAE AS7003 after demonstration of compliance with the requirements herein. The requirements may be supplemented by additional requirements specified by the NADCAP Nonconventional Machining and Surface Enhancement (NMSE) Task Group. Using the corresponding Audit Criteria (PRI AC7116) will ensure that accredited Nonconventional Machining suppliers meet all of the requirements in this standard and all applicable supplementary standards. The purpose of this audit program is to assess a supplier's ability to consistently provide a product or service that conforms to the technical specifications and customer requirements.

The advancement of both sensory and unmanned technology, combined with increased utilization of autonomous platforms in complex teaming scenarios, has created a need for practical design space exploration tools to aid in the synthesis of effective System-of-Systems (SoS). The presented work describes a modular, flexible, and extensible framework, referred to herein as the Technologies and Teaming Evaluation (TATE) framework, for straightforward identification of high-quality SoS, which may include both manned and autonomous elements, through quantitative evaluation of system-level and SoS-level attributes against a set of user-defined reference tasks.

SAE International is inviting global participation in its AeroTech® aerospace and defense technology conference and exhibition, which is for the first time co-located with ASM International’s AeroMat, at the Pasadena Convention Center in Pasadena, California, March 15 through 17, 2022.

Mobile heavy article tilter and positioner (HATP) is special purpose vehicle designed to level, articulate and positioning of very heavy load within the accuracy of arc minutes and in a stipulated time in fully auto mode. HATP system uses sophisticated electronic controller system to carry out required task in auto mode. This electronic controller system comprises of various types of electronic hardware, software, sensors and actuators. As this system is dealing with heavy load, any failure in any of subsystem of HATP can result into catastrophe. Therefore active and passive safety measure at various levels must be incorporated into system which firstly prevents the failure and reduce the effect of failure. The safety system for HATP system has been divided in three major levels: 1. Access level safety 2. Operational safety 3. Preventive safety. All three levels of safety is incorporated at appropriate subsystem based on Risk Priority Number (RPN) and failure mode effect analysis.

Project Oculus is an in-flight deployable mechanical arm/pod system that will accommodate 500 pounds of sensor payload, developed for a C-130 military aircraft. The system is designed for use in counter narco-terrorism and surveillance applications by the Department of Defense and the National Guard [1]. A prototype of the system has been built and is in the testing/analysis phase. The purpose of this study was to analyze the actual stresses and strains in the critical areas found using previous Finite Element (FE) simulations and to ensure that acceptable safety requirements have been met. The system components tested will be redesigned, tested, and reconstructed in the case of unacceptable safety factors or if more reliable methods can be implemented. The system was built to be deployed and retracted in flight, to avoid causing any problems in take off and landing.

This recommended practice provides guidance on vehicle Cybersecurity and was created based off of, and expanded on from, existing practices which are being implemented or reported in industry, government and conference papers. The best practices are intended to be flexible, pragmatic, and adaptable in their further application to the vehicle industry as well as to other cyber-physical vehicle systems (e.g., commercial and military vehicles, trucks, busses). Other proprietary Cybersecurity development processes and standards may have been established to support a specific manufacturer’s development processes, and may not be comprehensively represented in this document, however, information contained in this document may help refine existing in-house processes, methods, etc. This recommended practice establishes a set of high-level guiding principles for Cybersecurity as it relates to cyber-physical vehicle systems.

This third edition of Automatic Target Recognition provides a roadmap for breakthrough ATR designs―with increased intelligence, performance, and autonomy. Clear distinctions are made between military problems and comparable commercial deep-learning problems. These considerations need to be understood by ATR engineers working in the defense industry as well as by their government customers. A reference design is provided for a next-generation ATR that can continuously learn from and adapt to its environment. The convergence of diverse forms of data on a single platform supports new capabilities and improved performance. This third edition broadens the notion of ATR to multisensor fusion. Radical continuous-learning ATR architectures, better integration of data sources, well-packaged sensors, and low-power teraflop chips will enable transformative military designs.

Abstract The advancement in vision sensors and embedded technology created the opportunity in autonomous vehicles to look ahead in the future to avoid potential obstacles and steep regions to reach the target location as soon as possible and yet maintain vehicle safety from rollover. The present work focuses on developing a nonlinear model predictive controller (NMPC) for a high-speed off-road autonomous vehicle, which avoids undesirable conditions including stationary obstacles, moving obstacles, and steep regions while maintaining the vehicle safety from rollover. The NMPC controller is developed using CasADi tools in the MATLAB environment. The CasADi tool provides a platform to formulate the NMPC problem using symbolic expressions, which is an easy and efficient way of solving the optimization problem. In the present work, the vehicle lateral dynamics are modeled using the Pacejka nonlinear tire model.

The aerospace industry is facing immense challenges due to increased design complexity and higher levels of integration, particularly in the electrification of aircraft. These challenges can easily impact program cost and product time to market. System electrification and electromagnetic compatibility (EMC) have become critical issues today. In the context of 3D electromagnetics, EMC electromagnetic compatibility ensures the original equipment manufacturer (OEM) that radiated emissions from various electronic devices, such as avionics or the entire aircraft for that matter, do not interfere with other electronic products onboard the aircraft.

Abstract The demand for contactless, rapid manufacturing has increased over the years, especially during the COVID-19 pandemic. Additive manufacturing (AM), a type of rapid manufacturing, is a computer-based system that precisely manufactures products. It proves to be a faster, cheaper, and more efficient production system when integrated with cloud-based manufacturing (CBM). Similarly, the need for semiconductors has grown exponentially over the last five years. Several companies could not keep up with the increasing demand for many reasons. One of the main reasons is the lack of a workforce due to the COVID-19 protocols. This article proposes a novel technique to manufacture semiconductor chips in a fast-paced manner. An algorithm is integrated with cloud, machine vision, sensors, and email access to monitor with live feedback and correct the manufacturing in case of an anomaly.