This Aerospace Recommended Practice (ARP) describes the processing system and techniques for the surface preparation and priming of aluminum alloy parts for structural adhesive bonding to achieve optimum bondline durability, corrosion resistance, and manufacturing producibility. While this surface preparation has been developed and validated for two high strength aluminum alloys, 2024 and 7075, in the hardened condition it is expected to be applicable to other alloys and tempers. This surface preparation system has been validated for use with 180 degrees F (82 degrees C) and with 250 degrees F (121 degrees C) curing elastomer-modified epoxy adhesive and corrosion-inhibiting primer. The processes described herein are the result of laboratory evaluation of structural and durability performance.
This Aerospace Recommended Practice (ARP) describes the processing system and techniques for the surface preparation and priming of aluminum alloy parts for structural adhesive bonding to achieve optimum bondline durability, corrosion resistance, and manufacturing producibility.
This SAE Aerospace Recommended Practice describes the aluminum weldbonding process for fabrication of secondary aircraft structural assemblies possessing excellent strength, fatigue life, and environmental durability.
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.
This specification covers paper base honeycomb material having a cell size of 0.330 or 0.440 in. (8.38 or 11.18 mm). Unless otherwise ordered, size 0.440 in. (11.18 mm) be supplied.
This specification covers paper base honeycomb material having a cell size of 0.440 in. (11.18 mm). Unless otherwise ordered, size 0.440 in. (11.18 mm) will be supplied.
This specification and its supplementary detail specifications cover intermediate modulus para-aramid organic fibers in the form of continuous, multifilament yarn and roving.
This specification and its supplementary detail specifications cover intermediate modulus para-aramid organic fibers in the form of continuous, multifilament yarn and roving.
This specification and its supplementary detail specifications cover interleaf carrier materials in the form of polyethylene film or coated paper tape or sheeting.
This specification covers honeycomb core made of polyamide paper sheets and supplied in the form of blocks, slices, and ordered shapes, the cells of the core being in an overexpanded, rectangular configuration.
This specification covers expanded honeycomb core made of glass cloth impregnated with polyimide resin and supplied in the form of blocks, slices, and ordered shapes.
This specification covers honeycomb core made of polyamide paper sheets in a non-hexagonal, flexible cell configuration and supplied in the form of blocks, slices, and ordered shapes.