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We have achieved significant weight reduction for the MS (Multi-Tank Super Slim Structure) Evaporator (1)currently in production at DENSO CORPORATION. The evaporator of HVAC unit, located in the instrument panel, is a component of the aluminum heat exchanger used in automotive air conditioners. The new evaporator uses thinner quad-layer sheet material, thanks to optimization of the electrical potential among its outer filler metal, intermediate anodic layer and core. The evaporator is thus lighter than conventional evaporators, but retains equivalent corrosion resistance.

Having a light weight, a good heat conductivity and a good brazability, aluminum alloy is widely used for automotive heat exchanger systems. The major problem with Aluminum is perforation of the tube by pitting corrosion and corrosion protection is necessary in the field. In radiator and condenser systems using the the Nocolok brazing process given good corrosion resistance using cathodic protection with sacrificial anode made of Zn-sprayed onto tube or low corrosion potential fins etc. On the other hand, in drawn-cup type evaporators, that are fabricated from brazing sheet tubes in vacuum brazing method and then covered low electro-conductive drain water film in operation, the effect of cathodic protection by the anode fin is limited to a very small area. Therefore, this has been studied to improve self-corrosion resistance of the core in the brazing sheet tube.

In conventional automobile designs, a radiator and a condenser are typically configured and mounted independently of each other. We have developed a smaller and more powerful cooling module by integrating these two products into one piece. The new cooling module has been designed to share the fin material and to have an insulating slit and other means for effective prevention of heat loss that occurs due to thermal conduction between the radiator and the condenser1). In addition, as one of the key techniques for integrating fins, we studied thermal spraying of brazing filler to the tube material and were able to achieve a practical-level cooling module through use of high-performance fins, contributing largely to the efforts to create a more compact, higher performance cooling module.

In a conventional soldering process, solvents, such as chlorofluorocarbons (CFCs), have been necessary to remove the flux-residue after soldering. A new CFC-free fluxless soldering process has been developed to obtain high sealing ability even in a small soldering area. This new process utilizes a reducing atmosphere with an appropriate load and assembly orientation to solder the parts. Under this fluxless condition, it is found that appropriate loading and good solder-wettability of the upper part increase the wettability of the lower part.

Through the years, aluminum automotive heat exchangers have been developed in order to have a high performance and a light weight. Therefore, the thickness of the aluminum sheets for the application has been reduced. As the brazeability declines with the reduction in thickness, fins having a thickness under 80μm may be difficult to secure a good brazeability. Therefore, we studied the brazeability to determine the limit of thickness using clad fins from 40 to 80μm. The fillet volume formed at the joints of the fin and tube decreased with the decreasing fin thickness and the Si content in both the filler metals and the core alloys. The suitable range of Si content in the filler metals and the core alloys to obtain a good brazeability decreased with the decreasing fin thickness. When the fins were thinner than the critical values, it was impossible to have a good brazeability.

Recently, automotive semiconductor devices need miniaturization. One of the most important technologies is the package which encapsulates devices. In addition, the outer shape of the package is needed to change according to the mounted space. Conventional devices are mounted in the case, and encapsulated with potting resin. However this package structure is difficult to miniaturize because the case size limit. This report describes the development of the packaging technology for miniature and particular outer shape. The devices are set in the cavity and molded to one package. The three-dimension flow simulation is applied to analyze the flow in the cavity. The results of simulation correspond with experimental results. The cavity structure and the mold resin can be optimized by the simulation.