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TPO is getting wider acceptance for automotive applications. An exterior application like a fascia is a very good example. Interiors are still a challenge due to many reasons including overall system cost. For interior applications, “all-olefin” means it mainly consists of three materials: TPO skin, cross-linked olefinic-based foam and PP substrate. The driving force for TPO in Europe is mainly recyclability while in the USA, it is long-term durability. This paper describes the key limitations of the current TPO systems which are: poor grain retention of TPO skin, shrinkage in-consistency of the skin, high cost of priming (or other treatments) and painting of the skin, lower process window of the semi-crystalline TPO material during thermoforming or In-mold lamination / Low pressure molding, high cost of the foam, low tear strength of the foam for deep draw ratio etc.

Balancing the fill sequence of multiple cavities in a rubber injection mold is desirable for efficient cure rates, optimized cure times, and consistent quality of all molded parts. The reality is that most rubber injection molds do not provide a consistent uniform balanced fill sequence for all the cavities in the mold - even if the runner and cavity layout is geometrically balanced. A new runner design technique, named “The Vanturi Effect”, is disclosed to help address the inherent deficiencies of traditional runner and cavity layouts in order to achieve a more balanced fill sequence. Comparative analysis of molded runner samples reveals a significant and positive improvement in runner and cavity fill balancing when the Vanturi Effect is integrated into the runner design.

The development of an analytical model for multilayer stack subjected to temperature change is demonstrated here. Thin continuous layers of materials bonded together deform as a plate due to their differing coefficients of thermal expansion upon subjecting the bonded materials to the change in temperature. Applications of such structures can be found in the electronics industry (the study of warpage issues in printed circuit boards) or in the aerospace industry as (the study of laminated thin sheets used as skin structures for load bearing members such as wings and fuselage). In automotive electronics, critical high-power packages (IGBT, Power FETs) include several layers of widely differing materials (aluminum, solder, copper, ceramics) subjected to wide temperature cyclic ranges. Modeling of such structures by using three-dimensional finite element methods is usually time consuming and may not exactly predict the inter-laminar strains.

The fundamental relationship between semi-solid processing and microstructure and their effect on the flow characteristics of semi-solid metals have been studied for several years. However, how the process related microstructure influences fatigue properties has not been given the same attention. This study examines the influence of process-related microstructure on the fatigue properties of semi-solid formed A357 alloys. High-solid-fraction (62% solid) and low-solid-fraction (31% and 36% solid) semi-solid formed A357 was tested in axial fatigue with a stress ratio (R) equal to -1. The high solid fraction (HSF) material had better fatigue properties than the low solid fraction (LSF) material. This is attributed to the fatigue crack initiation mechanisms, as related to the fatigue crack initiation features and the strengths of the materials.

Lead-free solders for electronics have been actively pursued since the early 1990's here and abroad for environmental, legislative, and competitive reasons. The National Center for Manufacturing Sciences (NCMS-US)1, the International Tin Research Institute (ITRI-UK)2, Swedish Institute of Production Engineering Research (IVF-Sweden)3, Japan Institute of Electronics Packaging (JIEP Japan)4, Improved Design Life and Environmentally Aware Manufacture of Electronics Assemblies by Lead-free Soldering (IDEALS-Europe)5, and, more recently, the National Electronics Manufacturing Initiative (NEMI-US)6 have been aggressively seeking lead-free solutions The automotive industry has some unique requirements that demand extensive testing of new materials and processes prior to implementation. The specific steps taken at Delphi Automotive Systems with lead-free solder will be described along with the lessons learned along the way.

Desiring to push thermoplastic poly-olefin (TPO) technology to its fullest limits and to confirm our position as the leader in the manufacturing of environmentally friendly TPO instrument panels, we have designed a process to manufacture 100% recycled instrument panel skins. This closed-loop process begins with extruding 100% recycled TPO flake into sheet stock to be painted and vacuum formed. The painted sheet is vacuum formed and the offal is ground into regrind flake, ready to be extruded again, thus completing the closed-loop process. This paper will describe a 100% closed loop recycling process for TPO instrument panels, discuss the intense validation process for recycled material and prove the robustness and durability of this interior solution.

The utilization of Laser welding process has increased during last years in several areas of industry, due to many benefits that can be achieved with this technology, such as: flexibility, productivity and quality. Thus, the optimization of Laser welding processes has been considered as a “green field” to be explored by Laser manufacturers, automation companies and process/project engineers. Nowadays there are few researches that provide a roadmap for Laser welding processes improvement that approaches both the aspects and characteristics applied to evaluate the Laser weld application performance. Therefore, this paper has per its main purpose through an exploratory study to provide parameters toward continuous improvement of Laser welding process considering both types of Lasers: Laser spot weld and Laser seam weld of stainless steel joints, thus this work may be considered as theoretical and practical reference to be applied by people involved with Laser welding applications.

Miniaturization is an important trend in many technology segments, once it can enable innovative applications generating new markets. This trend was begun in electronics industry after World War II and has spawned changes into automotive sector also. For Automotive Wiring Harness, miniaturization is clearly presented in most of the components, mainly because of its benefits like the potential of mass reduction, cost reduction and efficiency improvement. Furthermore the main voice of customer points to cable gauge reduction that represents a considerable challenge for connection manufacturing process due to quality control limitations presented by conventional crimp process for 0,35 [mm₂] cables and smaller. According to that, the scope of this article is to present, in details, a manufacturing process optimization for an alternative and more robust technology of joining copper stranded cables to tin brass terminals used on automotive wiring harness, Resistance Welding.

The most popular aluminum alloys for semi-solid automotive components are A356 and A357. The density of rheocast semi-solid A357 is higher than die cast A357 and allows for both T5 and T6 heat treatment. The mechanical properties of rheocast semi-solid A357 was found to be more dependent upon the heat treat schedule and casting soundness than by the solid content of the semi-solid slurry or the globule shape.

Current generation automobiles are controlled by electronic modules for performing various functions. These electronic modules have numerous semiconductor devices mounted on printed circuit boards. Solders are generally used as thermal interface material between surface mount devices and printed circuit boards (PCB) for efficient heat transfer. In the manufacturing stage, voids are formed in solders during reflow process due to outgassing phenomenon. The presence of these voids in solder for power packages with exposed pads impedes heat flow and can increase the device temperature. Therefore it is imperative to understand the effect of solder voids on thermal characteristics of semiconductor devices. But the solder void pattern will vary drastically during mass manufacturing. Replicating the exact solder void pattern and doing detail simulation to predict the device temperature for each manufactured module is not practical.