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A power electronics module was equipped with an evaporative spray cooling nozzle assembly that served to remove waste heat from the silicon devices. The spray cooling nozzle assembly took the place of the standard heat sink, which uses single phase convection. The purpose of this work was to test the ability of spray cooling to enable higher power density in power electronics with high temperature coolant, and to be an effective and lightweight system level solution to the thermal management needs of aerospace vehicles. The spray cooling work done here was with 95 °C water, and this data is compared to 100 °C water/ propylene glycol spray cooling data from a previous paper so as to compare the spray cooling performance of a single component liquid to that of a binary liquid such as WPG. The module used during this work was a COTS module manufactured by Semikron, Inc., with a maximum DC power input of 180 kW (450 VDC and 400 A).