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Seven encapsulants with operating temperatures up to 250°C were surveyed for use in planar packages for wide-bandgap dice. Two of the encapsulants failed processability test because they were not able to flow, and another two failed because they induced voids or cracks after curing. The dielectric results of the remaining three encapsulants showed that both dielectric strength and permittivity decreased almost 40% when the temperature was increased up to 250°C. As the three encapsulants were used to encapsulate a power module, it was proven that all of them could protect the package from early breakdown caused by the poor dielectric strength of air.

The effect of Si-phase on the axial, low-cycle fatigue behavior of Al-Si eutectic alloys was investigated using test specimens prepared from alloys processed either by continuous casting or extrusion. Results indicate that, for continuous casting, all fatigue fractures resulted from shear-type crack initiation and propagation with an attendant shortening of fatigue life. For extruded material, fatigue cracks originated in the Si phase. In both instances, initiation and growth mechanisms were essentially identical to those observed in high-cycle fatigue. Cyclic properties obtained from phenomenological models are presented and discussed.

3D digital human modeling (DHM) tools for vehicle packaging facilitate ergonomic design and evaluation based on anthropometry, comfort, and force analysis. It is now possible to quickly predict postures and positions for drivers with selected anthropometry based on ergonomics principles. Despite their powerful visual representation technology for human movements and postures, these tools are still questioned with regard to the validity of the output they provide, especially when predictions are made for different populations. Driving postures and positions of two populations (i.e. North Americans and Koreans) were measured in actual and mock-up SUVs to investigate postural differences and evaluate the results provided by a DHM tool. No difference in driving postures was found between different stature groups within the same population. Between the two populations, however, preferred angles differed for three joints (i.e., ankle, thigh, and hip).

Modern fatigue analysis techniques, that can provide reliable estimates of the service performance of components and structures, are finding increasing use in vehicle development programs. A major objective of such efforts is the prediction of the field performance of a fleet of vehicles as influenced by the host of design, manufacturing, and performance variables. An approach to this complex problem, based on the incorporation of probability theory in established life prediction methods, is presented. In this way, quantitative estimates of the lifetime distribution of a population are obtained based on anticipated, or specified, variations in component geometry, material processing sequences, and service loading. The application of this approach is demonstrated through a case study of an automotive transmission component.

Long-duration space missions require high-quality, nutritious foods, which will need reheating to serving temperature, or sterilization on an evolved planetary base. The package is generally considered to pose a disposal problem after use. We are in the process of development of a dual-use package wherein the food may be rapidly reheated in situ using the technology of ohmic heating. We plan to make the container reusable, so that after food consumption, the package is reused to contain and sterilize waste. This approach will reduce Equivalent System Mass (ESM) by using a compact heating technology, and reducing mass requirements for waste storage. Preliminary tests of the package within a specially-designed ohmic heating enclosure show that ISS menu item could easily be heated using ohmic heating technology. Mathematical models for heat transfer were used to optimize the layout of electrodes to ensure uniform heating of the material within the package.

The incorporation of reliability theory into a fatigue analysis algorithm is studied. This probabilistic approach gives designers the ability to quantify “real world” variations existing in the material properties, geometry, and loading of engineering components. Such information would serve to enhance the speed and accuracy of current design techniques. An automobile wheel assembly is then introduced as an example of the applications of this durability/reliability design package.

The road profile has been shown to have significant effects on various vehicle conditions including ride, handling, fatigue or even energy efficiency; as a result it has become a variable of interest in the design and control of numerous vehicle parts. In this study, an integrated state estimation algorithm is proposed that can provide continuous information on road elevation and profile variations, primarily to be used in active suspension controls. A novel tire instrumentation technology (smart tire) is adopted together with a sensor couple of wheel attached accelerometer and suspension deflection sensor as observer inputs. The algorithm utilizes an adaptive Kalman filter (AKF) structure that provides the sprung and unsprung mass displacements to a sliding-mode differentiator, which then yields to the estimation of road elevations and the corresponding road profile along with the quarter car states.

Nano-silver sintered bonding was carried out at 275°C and under 3MPa pressures, and soldering in a vacuum reflowing oven to reduce voiding. Both joints are subject to large shear stresses due to the mismatch in coefficients of thermal expansion (CTE) between the chip and the substrate. In this study, residual stresses in the chip-on-substrate assemblies were determined by measuring the bending curvatures of the bonded structures. An in-house optical setup measured the bending curvatures using a thin-film stress measurement technique. From the measured bending curvatures and the mechanical properties of the constituent materials, residual stresses were calculated. The thermo-mechanical reliabilities of both joining techniques were tested by thermal cycling. The chip assemblies were cycled between -40°C and 125°C (100 minutes of cycle time, 10 minutes of dwell time) and the changes in their bending curvatures were measured.