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The use of lead-free (Pb-free) solder and plating in onboard electronic components has accelerated rapidly in recent years, but solutions have yet to be found for the issues of whisker generation in tin (Sn) plating and crack initiation in Pb-free solder, despite widespread research efforts. Analysis of the whisker generation mechanism has focused on internal energy levels and crystal orientation, and analysis of the crack initiation mechanism in Pb-free solder has examined changes in the grain boundaries of Sn crystals.

Port fuel injection (PFI) injector and direct fuel injection (DI) injector clogging from deposits caused by poor fuel quality, is a concern in emerging countries. Then DI injector deposits are sometimes cleaned by injector cleaners in such situation. However deposit cleaners for PFI injectors have not been developed, because of the lack of research of PFI injector deposits. Through chemical analysis, this study showed them to be water-soluble deposits. Subsequently success was achieved in developing a new gasoline injector cleaner applicable to injector deposits in both types of injectors, through optimization of a surface active agent.