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Standard

350 °F Autoclave Cure, Low Flow Toughened Epoxy Prepregs, Type 35, Class 1, Grade 190, Fiber 1
2019-03-12
WIP
AMS3961/3A
The intent of this specification is for the procurement of the material listed on the QPL and, therefore, no qualification or equivalency threshold values are provided. Users that intend to conduct a new material qualification or equivalency program shall refer to the Quality Assurance section of the base specification, AMS3961. All material qualification and equivalency data has been archived and is available for review upon request. Contact the CMH-17 Secretariat (www.cmh17.org) for additional information.
Standard

350 °F Autoclave Cure, Low Flow Toughened Epoxy Prepregs, Type 35, Class 1, Grade 190, Fiber 1
2015-12-02
CURRENT
AMS3961/3
The intent of this specification is for the procurement of the material listed on the QPL and, therefore, no qualification or equivalency threshold values are provided. Users that intend to conduct a new material qualification or equivalency program shall refer to the Quality Assurance section of the base specification, AMS3961. All material qualification and equivalency data has been archived and is available for review upon request. Contact the CMH-17 Secretariat (www.cmh17.org) for additional information.
Standard

350 °F Autoclave Cure, Low Flow Toughened Epoxy Prepregs, Type 35, Class 1, Grade 190, Fiber 2
2015-12-02
CURRENT
AMS3961/2
The intent of this specification is for the procurement of the material listed on the QPL and, therefore, no qualification or equivalency threshold values are provided. Users that intend to conduct a new material qualification or equivalency program shall refer to the Quality Assurance section of the base specification, AMS3961. All material qualification and equivalency data has been archived and is available for review upon request. Contact the CMH-17 Secretariat (www.cmh17.org) for additional information.
Standard

350 °F Autoclave Cure, Low Flow Toughened Epoxy Prepregs, Type 35, Class 1, Grade 190, Fiber 2
2019-03-12
WIP
AMS3961/2A
The intent of this specification is for the procurement of the material listed on the QPL and, therefore, no qualification or equivalency threshold values are provided. Users that intend to conduct a new material qualification or equivalency program shall refer to the Quality Assurance section of the base specification, AMS3961. All material qualification and equivalency data has been archived and is available for review upon request. Contact the CMH-17 Secretariat (www.cmh17.org) for additional information.
Standard

350 °F Autoclave Cure, Low Flow Toughened Epoxy Prepregs, Type 38, Class 2, Grade 193, Style 3K-70-PW, Fiber 1
2015-12-02
CURRENT
AMS3961/1
The intent of this specification is for the procurement of the material listed on the QPL and, therefore, no qualification or equivalency threshold values are provided. Users that intend to conduct a new material qualification or equivalency program shall refer to the Quality Assurance section of the base specification, AMS3961. All material qualification and equivalency data has been archived and is available for review upon request. Contact the CMH-17 Secretariat (www.cmh17.org) for additional information.
Standard

350 °F Autoclave Cure, Low Flow Toughened Epoxy Prepregs, Type 38, Class 2, Grade 193, Style 3K-70-PW, Fiber 1
2019-03-12
WIP
AMS3961/1A
The intent of this specification is for the procurement of the material listed on the QPL and, therefore, no qualification or equivalency threshold values are provided. Users that intend to conduct a new material qualification or equivalency program shall refer to the Quality Assurance section of the base specification, AMS3961. All material qualification and equivalency data has been archived and is available for review upon request. Contact the CMH-17 Secretariat (www.cmh17.org) for additional information.
Standard

Application of Direct Pressure to Resin in Curing of Epoxy and Addition Type Polyimides
2022-06-07
CURRENT
ARP1927
This recommended practice describes the materials, related equipment, and particular processing techniques utilized in process science curing of composite hardware where pressure is imparted specifically to the resin of curing composites. Included as Appendix "A" to this ARP is a discussion of the particular techniques developed for a processing science philosophy which has consistently produced void and porosity-free, large area, thick composite structures.
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