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Non-conformance and now Suspect counterfeit packaging represents a hazard to electrostatic discharge (ESD) sensitive devices or components through cross contamination during transport and storage while generating high voltage discharges to ESD sensitive devices during in shipping, the inspection process, handling and manufacturing. Several aerospace related issues involve long-term storage supplier non-conformance with antistatic foams, antistatic bubble, antistatic pink poly, vacuum formed antistatic polymers, Type I moisture barrier bags and Type III static shielding bags have posed issues. The late John Kolyer, Ph.D. (Boeing, Ret.) and Ray Gompf, P.E., Ph.D. (NASA-KSC, Ret.) were advocates in the utilization of a formalized physical testing material qualification process. Today, however, prime contractors and CMs rely heavily upon a visual inspection process for ESD packaging materials.

The criteria defined herein shall be utilized by an ISO/IEC 17025 Accreditation Body (AB) to establish conformance with AS6171 Test Methods Standard; General Requirements, Suspect/Counterfeit, Electrical, Electronic, and Electromechanical Parts and associated AS6171 Test Methods requested/included on the scope of accreditation.

This document describes an assessment of the effectiveness of a specified test plan used to screen for counterfeit parts. The assessment includes the determination of the types of defects detected using a specified test plan along with the related counterfeit type coverage. The output of this evaluation will produce Counterfeit Defect Coverage (CDC), Counterfeit Type Coverage (CTC), Not-Covered Defects (NCDs), and Under-Covered Defects (UCDs). This information will be supplied to the test laboratory’s customer in both the test report and the Certificate of Quality Conformance (CoQC). This evaluation method does not address the effectiveness of detecting tampered type devices. The Test Evaluation Method also describes an Optimized Test Sequence Selection, in which a test sequence is selected that maximizes the CDC utilizing test cost and time as constraints, for any tier level except the Critical Risk Level. The constraints can be adjusted until the desired CDC is achieved.

The intent of this document is to define the methodology for suspect/counterfeit parts inspection using REME Analysis. The purpose of REME Analysis for suspect counterfeit part inspection is to detect misrepresentation or tampering of a part. REME Analysis can also potentially detect unintentional damage to the part resulting from improper removal of the part from assemblies, exposure to electrostatic discharge, exposure to radiation outside of acceptable limits (ionizing or high-power electromagnetic), or degradation. Improper removal of part from assemblies may include, but is not limited to, prolonged elevated temperature exposure during desoldering operations or mechanical stresses during removal. Degradation may include, but is not limited to, prolonged burn-in/testing, exposure to out-of-specification environmental conditions, or use outside of expected electrical tolerances.

Acoustic Microscopy Test Methods for Counterfeit Capacitors

This document defines capabilities and limitations of LSM and CLSM as they pertain to suspect/counterfeit EEE part detection. Additionally, this document outlines requirements associated with the application of LSM and CLSM including: operator training, sample preparation, various imaging techniques, data interpretation, calibration, and reporting of test results. This test method is primarily directed to analyses performed in the visible to near infrared range (approximately 400nm to 1100nm). The Test Laboratory shall be accredited to ISO/IEC 17025 to perform the LSM and CLSM Test Methods as defined in this standard. The Test Laboratory shall indicate in the ISO/IEC 17025 Scope statement, the specific method being accredited to: Option 1: All AS6171/17 Test Methods, or Option 2: All AS6171/17 Test Methods except CLSM. If SAE AS6171/17 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.

To define capabilities and limitations of SEM-EDS as it pertains to counterfeit detection of EEE parts and suggest possible applications to these ends. Additionally, this document outlines requirements associated with the application of SEM-EDS including: Operator training; Sample preparation; Data interpretation; Equipment maintenance; and Reporting of data. If SAE AS6171/22 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.

This document defines the capabilities and limitations of SIMS as they pertain to Suspect/Counterfeit EEE part detection. Additionally, this document outlines requirements associated with the application of SIMS including: operator training, sample preparation, data interpretation, equipment maintenance, and reporting of data. The Test Laboratory shall be accredited to ISO/IEC 17025 to perform the SIMS Test Method as defined in this standard. The Test Laboratory shall indicate in the ISO/IEC 17025 scope statement the specific method being accredited to: Option 1: All AS6171/13 Test Methods, or Option 2: All AS6171/13 Test Methods except 2D Imaging and 3D Imaging, or Option 3: All AS6171/13 Test Methods except Depth Profiling and 3D Imaging. If SAE AS6171/13 is invoked in the contract, the base document, AS6171 General Requirements, shall also apply.

The intent of this test method is to describe high level processes to detect suspect/counterfeit (SC) Electrical, Electronic, and Electromechanical (EEE) Assemblies, covering both custom and military/commercial off-the-shelf (COTS) assemblies. This standard includes requirements for accreditation and certification of Laboratory and Laboratory personnel, and also, data collection, interpretation, and reporting as applicable to this test method. This standard covers EEE assemblies and includes electronic circuit card assemblies as defined under the definition for EEE Assembly and Electronic Circuit Card Assembly.

This test method provides the capabilities, limitations, and suggested possible applications of TMA as it pertains to detection of suspect/counterfeit EEE parts. Additionally, this document outlines requirements associated with the application of TMA including: equipment requirements, test sample requirements, methodology, control and calibration, data analysis, reporting, and qualification and certification.

Through the use of ultra-high frequency ultrasound, typically above 10 MHz, Acoustic Microscopy (AM) non-destructively finds and characterizes physical features and latent defects (visualization of interior features in a layer by layer process) - such as material continuity and discontinuities, sub-surface flaws, cracks, voids, delaminations and porosity. AM observed features and defects can be indicators that the components were improperly handled, stored, altered or previously used. If AS6171/6 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.

Through the use of ultra-high frequency ultrasound, typically above 10 MHz, Acoustic Microscopy (AM) non-destructively finds and characterizes physical features and latent defects (visualization of interior features in a layer by layer process) - such as material continuity and discontinuities, sub-surface flaws, cracks, voids, delaminations and porosity. AM observed features and defects can be indicators that the components were improperly handled, stored, altered or previously used. If AS6171/6 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.

This document defines capabilities and limitations of Auger Electron Spectroscopy (AES) as it pertains to detection of suspect/counterfeit EEE parts and suggests possible applications to these ends. Additionally, this document outlines requirements associated with the application of AES including: operator training and requirements; sample preparation; data interpretation and reporting of data.

This method standardizes inspection, test procedures and minimum training and certification requirements to detect Suspect/Counterfeit (SC) Electrical, Electronic, and Electromechanical (EEE) components or parts utilizing Delid/Decapsulation Physical Analysis. The methods described in this document are employed to either delid or remove the cover from a hermetically sealed package or to remove the encapsulation or coating of an EEE part, in order to examine the internal structure and to determine if the part is suspect counterfeit. Information obtained from this inspection and analysis may be used to: a prevent inclusion of counterfeit parts in the assembly b identify defective parts c aid in disposition of parts that exhibit anomalies This test method should not be confused with Destructive Physical Analysis as defined in MIL-STD-1580. MIL-STD-1580 describes destructive physical analysis procedures for inspection and interpretation of quality issues.

This method standardizes inspection, test procedures and minimum training and certification requirements to detect Suspect/Counterfeit (SC) Electrical, Electronic, and Electromechanical (EEE) components or parts utilizing Delid/Decapsulation Physical Analysis. The methods described in this document are employed to either delid or remove the cover from a hermetically sealed package or to remove the encapsulation or coating of an EEE part, in order to examine the internal structure and to determine if the part is suspect counterfeit. Information obtained from this inspection and analysis may be used to: a. prevent inclusion of counterfeit parts in the assembly b. identify defective parts c. aid in disposition of parts that exhibit anomalies This test method should not be confused with Destructive Physical Analysis as defined in MIL-STD-1580. MIL-STD-1580 describes destructive physical analysis procedures for inspection and interpretation of quality issues.

This method outlines the requirements, capabilities, and limitations associated with the application of Design Recovery for the detection of counterfeit electronic parts including: Operator training; Sample preparation; Imaging techniques; Data interpretation; Design/functional matching; Equipment maintenance and; Reporting of data. The method is primarily aimed at analyses performed by circuit delayering and imaging with a scanning electron microscope or optical microscope; however, many of the concepts are applicable to other microscope and probing techniques to recover design data. The method is not intended for the purpose of manufacturing copies of a device, but rather to compare images or recover the design for determination of authenticity. If AS6171/11 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.

This method outlines the requirements, capabilities, and limitations associated with the application of Design Recovery for the detection of counterfeit electronic parts including: Operator training; Sample preparation; Imaging techniques; Data interpretation; Design/functional matching; Equipment maintenance and; Reporting of data. The method is primarily aimed at analyses performed by circuit delayering and imaging with a scanning electron microscope or optical microscope; however, many of the concepts are applicable to other microscope and probing techniques to recover design data. The method is not intended for the purpose of manufacturing copies of a device, but rather to compare images or recover the design for determination of authenticity. If AS6171/11 is invoked in the contract, the base document, AS6171 General Requirements shall also apply. SAE Counterfeit Defect Coverage Tool

The scope of this document is to: 1 Specify techniques to detect SC parts using electrical testing. 2 Provide various levels of electrical testing that can be used by the User to define test plans for detecting SC parts. 3 Provide minimum requirements for testing laboratories so that User/Requester can determine which test houses have the necessary capabilities. (For example: technical knowledge, equipment, procedures and protocols for performing electrical testing for verification analysis.) Note: User/Requester is defined in AS6171 General Requirements 4 Specify Burn-In and environmental tests. The environmental tests include Temperature Cycling for Active Devices and Thermal Shock for Passive Devices. Seal Tests are described and recommended for hermetic devices. The following terminology is used throughout this document: a Shall = is mandatory; b Should = is recommended; and c Will = is planned (is considered to be part of a standard process).

This document defines capabilities and limitations of FTIR spectroscopy as it pertains to counterfeit electronic component detection and suggests possible applications to these ends. Additionally, this document outlines requirements associated with the application of FTIR spectroscopy including: operator training, sample preparation, various sampling techniques, data interpretation, computerized spectral matching including pass/fail criteria, equipment maintenance, and reporting of data. The discussion is primarily aimed at analyses performed in the mid-infrared (IR) from 400 to 4000 wavenumbers; however, many of the concepts are applicable to the near and far IR. If AS6171/9 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.

This document defines capabilities and limitations of Gas Chromatography/Mass Spectrometry (GC/MS) as it pertains to detection of suspect/counterfeit EEE parts and suggests possible applications to these ends. Additionally, this document outlines requirements associated with the application of GC/MS including: operator training; sample preparation; various sampling techniques; data interpretation; computerized spectral matching; equipment maintenance; and reporting of data. The discussion is limited to unit mass resolution spectrometers such as quadrupole systems and electron impact ionization.