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Abstract The demand for contactless, rapid manufacturing has increased over the years, especially during the COVID-19 pandemic. Additive manufacturing (AM), a type of rapid manufacturing, is a computer-based system that precisely manufactures products. It proves to be a faster, cheaper, and more efficient production system when integrated with cloud-based manufacturing (CBM). Similarly, the need for semiconductors has grown exponentially over the last five years. Several companies could not keep up with the increasing demand for many reasons. One of the main reasons is the lack of a workforce due to the COVID-19 protocols. This article proposes a novel technique to manufacture semiconductor chips in a fast-paced manner. An algorithm is integrated with cloud, machine vision, sensors, and email access to monitor with live feedback and correct the manufacturing in case of an anomaly.

This 2-day foundational-level course builds on geometric dimensioning and tolerancing fundamentals and teaches an introduction of how to inspect GD&T requirements.  The course offers an explanation of the geometric symbols, rules, and concepts, the datum system, and how to inspect GD&T requirements using tools from the four categories of inspection tools (CMM; comparison instruments and fixed gages; hand tools and open set up; and production gaging systems).

Additive manufacturing (AM) technology, also known as 3D printing, has transitioned from concepts and prototypes to part-for-part substitution and the creation of unique AM-specific part geometries. These applications are increasingly present in demanding, mission-critical fields such as medicine and aerospace, which require materials with certain thermal, stiffness, corrosion, and static loading properties. To advance in these arenas, metallic, ceramic, and polymer composite AM parts need to be free from discontinuities. The manufacturing processes have to be stable, robust, and repeatable. And the nondestructive testing (NDT) technology and inspection methods will need to be sufficiently capable and reliable to ensure that discontinuities will be detected to prevent the components from being accepted for use. As the second installment of a six-part series of SAE EDGE™ Research Reports on AM, this one discusses the need, challenges, technologies, and opportunities for NDT in AM.