Investigation of Whisker Formation on Tin Plated Conductors(STABILIZED Dec 2014)
This SAE Aerospace Information Report (AIR) shall be limited to general information about tin whisker formation on tin plated conductors. It summarizes the mechanisms of metal whisker formation and describes possible conclusions as related to tin plated conductors. It also provides a number of reference documents that describes research and observations of the whisker phenomena, recommendations to prevent its formation and conclusions.
The investigation by this task group of AE-8D was initiated by a request of the Naval Air Warfare Center, Indianapolis, Indiana, to determine if the phenomenon of tin whiskers is a problem in aerospace wire and cable.
This document has been determined to be out of date. Significant additional work by industry to further document the background and issues related to the formation, consequences, and possible mitigation actions of tin whiskers on electronic parts is located in GEIA-STD-0005-2, "Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems."