AMS2405D has been reactivated and revised to include the latest requirements on hydrogen embrittlement relief consistent with similar plating specifications.
ORDERING INFORMATION: The following information shall be provided to the plating processor by the purchaser.
Purchase order shall specify not less than the following:
Plating thickness desired
Basis metal to be plated
Tensile strength or hardness of the basis metal (steel alloys only)
Pre-plate stress relief to be performed by plating processor (time and temperature) if different from 3.1.4.
Special features, geometry or processing present on parts that require special attention by the processor
Hydrogen embrittlement relief to be performed by plating processor if different from 3.3
Post plating bake to be performed by plating processor (to harden plating on substrates capable of high temperature, or to improve adhesion) (See 3.3.3)
Quantity of pieces to be plated
Parts manufacturing operations such as heat treating, forming, joining and media finishing can affect the condition of the substrate for plating, or if performed after plating, could adversely affect the plated part. The sequencing of these types of operations should be specified by the cognizant engineering organization or purchaser and is not controlled by this specification.