Browse Standards AMS2690C
Historical Reaffirmed 2011-10-03

Parallel Gap Welding, Microelectronic Interconnections to Thin Film Substrates(NONCURRENT Apr 2001) AMS2690C

This specification defines the equipment, procedures, and requirements for joining leads by parallel gap resistance welding. For attaching leads by parallel gap resistance welding in the assembly of microelectronic circuitry to thin film substrates.
AMS2690D
2017-09-19
Latest
Stabilized
AMS2690C
2011-10-03
Historical
Reaffirmed
AMS2690B
1993-05-01
Historical
Reaffirmed
AMS2690A
1982-04-01
Historical
Revised
AMS2690
1968-05-01
Historical
Issued

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