Resin, Polyimide, Laminating High Temperature Resistant, 315°C (599°F)
This specification covers a single-component, heat-reactive, thermosetting aromatic system which thermally cures to form a polyimide polymer structure. This product has been used typically as a resin matrix for fiber-reinforced- composite parts requiring good strength after long-term exposure up to 315 degrees C (599 degrees F) and after short-term exposure up to 370 degrees C (698 degrees F), but usage is not limited to such applications.
Rationale: This document has been revised to remove specific military requirements described in former sections 126.96.36.199, 5.1.5, and 8.3. MIL-STD-2073-1 was also deleted from section 2.3 since it was referenced in section 5.1.5.