Browse Standards AMS3684C
Current STABILIZED 2016-10-13

Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled(STABILIZED Oct 2016) AMS3684C

This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure.
AMS3684C
2016-10-13
Latest
Stabilized
AMS3684A
2011-08-12
Historical
Reaffirmed
AMS3684B
1993-01-01
Historical
Noncurrent
AMS3684
1975-09-01
Historical
Issued

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