Browse Standards AMS3690
Historical Issued 1960-01-01

Adhesive Compound, Epoxy, Room Temperature Curing AMS3690

This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste. This adhesive compound has been used typically for nonstructural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components operating at not higher than 185 °F (85 °C), but usage is not limited to such applications.
AMS3690D
2016-11-10
Latest
Stabilized
AMS3690C
2009-07-20
Historical
Revised
AMS3690B
2000-12-01
Historical
Reaffirmed
AMS3690A
1986-04-01
Historical
Reaffirmed
AMS3690
1960-01-01
Historical
Issued

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