Browse Standards AMS3692
Historical ISSUED 1960-01-01

Adhesive Compound, Epoxy Resin, High Temperature Application AMS3692

This specification covers a two-component adhesive compound, an epoxy resin base and a hardener, in the form of a paste.

This compound has been used typically for non-structural bonding of metals and thermosetting plastics, to themselves and to each other, and as an adhesive for electrical components and devices operating at not higher than 260 degrees C (500 degrees F), but usage is not limited to such applications.

AMS3692C
2014-08-14
Latest
Reaffirmed
AMS3692B
1993-01-01
Historical
Revised
AMS3692A
1986-04-01
Historical
Revised
AMS3692
1960-01-01
Historical
Issued

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