Browse Standards AMS3695/2
Current Reaffirmed 2014-08-14

Adhesive Film, Epoxy Base, High Durability, For 120°C (250°F) Service AMS3695/2

This specification covers an adhesive compounded from modified epoxy resins in ready-to-use film supplied in rolls or sheets, either supported by mat or by woven monofilaments or unsupported. Primarily for bonding metal-to-metal or aluminum honeycomb sandwich assemblies for service up to 120 degrees C (250 degrees F). Adhesive thickness 0.005 in. (0.13 mm) is not intended for honeycomb- to-metal bonds and adhesive thickness 0.015 in. (0.38 mm) is not intended for metal-to-metal bonds.
AMS3695/2
2014-08-14
Latest
Reaffirmed

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