Adhesive Film, Epoxy Base, High Durability, For 175°C (350°F) Service
This specification covers an adhesive compounded from modified epoxy resins in ready-to-use film supplied in rolls or sheets, either supported by mat or by woven monofilaments or unsupported. Primarily for bonding metal-to-metal or aluminum honeycomb sandwich assemblies for service up to 175 degrees C (350 degrees F). Adhesive thickness 0.005 in. (0.13 mm) is not intended for honeycomb- to-metal bonds and adhesive thickness 0.015 in. (0.38 mm) is not intended for metal-to-metal bonds.