Browse Standards AMS3731/10
Historical ISSUED 1981-10-01

POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible AMS3731/10

This specification covers an unfilled, room-temperature-polymerizing epoxy resin formulation with a polyamide hardener, supplied as a two-component system.
AMS3731/10C
2017-11-29
Latest
Stabilized
AMS3731/10B
1993-01-01
Historical
Noncurrent
AMS3731/10A
1987-10-01
Historical
Revised
AMS3731/10
1981-10-01
Historical
Issued

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