Browse Standards AMS3731/7C
Current CANCELLED 2016-09-22

Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage (Cancelled Sep 2016) AMS3731/7C

This specification covers a filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system.
AMS3731/7C
2016-09-22
Latest
Canceled
AMS3731/7A
2011-08-09
Historical
Reaffirmed
AMS3731/7B
1993-01-01
Historical
Noncurrent
AMS3731/7
1981-10-01
Historical
Issued

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Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant

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STANDARD

Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Machinable

AMS3731/3C

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