Browse Standards ARP1332C
Historical Revised 2007-02-20

Wave Soldering Procedure ARP1332C

The purpose of this recommended practice is to provide recommendations concerning the procedure for wave soldering. The detailed recommendations are based on manufacturing experience and laboratory experiments. The recommendations reflect those design practices and fabricating procedures which have been found to be most effective in producing functional electronic modules for critical communications or control systems. Electronic modules include assemblies, components, and printed circuit (PC) or printed wire (PW) boards. In the following text, references to printed circuit (PC) boards shall be construed to included printed wire (PW) boards.
ARP1332D
2013-08-12
Latest
Stabilized
ARP1332C
2007-02-20
Historical
Revised
ARP1332B
1997-03-01
Historical
Reaffirmed
ARP1332A
1988-04-01
Historical
Revised
ARP1332
1974-03-01
Historical
Issued

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