Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder
ARP6415
This document contains information and guidance on the use of Pb-free ball grid arrays (BGAs) in an aerospace, defense, and high performance (ADHP) product, or other products which demand a high reliability.
Rationale:
Aerospace, defense, and high performance (ADHP) manufacturers have avoided a transition to Pb-free for most products, but the limited availability of ball grid array packages with SnPb alloy solder balls has driven the use of parts with Pb-free solder balls. There have been numerous studies on the use of the Pb-free parts in a SnPb assembly, and this document provides a consolidated summary of the industry best practices and issues related to use of these Pb-free parts.
Related Topics:
Assembling
Joining
Production control
Identification numbers
X-ray inspections
Coatings, colorants, and finishes
Fatigue
Packaging
Also known as: SAE ARP 6415
SAE MOBILUS
Subscribers can view annotate, and download all of SAE's content.
Learn More »