Evaluation of Pb-free Material within Electronic Piece Parts
Piece part suppliers have been transition to using Pb-free solders within the parts themselves, such as Pb-free solder bumps. This document will provide guidance on necessary tests and evaluations for parts using Pb-free solders.
Rationale: Users of these parts need to evaluate whether the risks associated with the use of these materials are acceptable. Many mil-aero programs have restrictions on Pb-free solders. Users are developing internal qualification and evaluation plans for these parts with lack of industry coordination.