This document is an annex to EIA Engineering Bulletin SSB-1 (the latest revision).
This document provides reference information and guidance concerning methods used by the semiconductor industry and original equipment manufacturers related to radiation hardness assessments. This document is broken into three primary sections. Section 3.0 discusses part characterization with focus on selection criteria and acceptance testing. Section 4.0 discusses design hardening for piece parts with focus on degraded design limits and radiation design margin. The last section, Section 5.0, of this report is on hardness assurance inspection and test. This section discusses total ionizing dose, displacement damage and single event effects testing in detail.
Rationale: This document defines the guidelines for minimum tasks and methods for piece part radiation hardness assurance for plastic encapsulated microcircuits and semiconductors suitable for potential use in many rugged, military, space, extreme, or other environments. Those devices that were categorized as commercial off the shelf devices [COTS], plastic encapsulated microcircuit/microelectronic [PEM] and/or plastic encapsulated discrete semiconductor [PEDS]. The document provides the process flow for hardness and risk assessment when meeting project requirements. The document will review radiation environmental constraints, mission specifications, and their anticipated impact on the microelectronic devices as provided in a project’s bill of material (BOM). Parts are consider on an individual basis when assessed to environmental constraints and mission specifications.