Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace, and Other Rugged Applications SSB1D

DOI: https://doi.org/10.4271/SSB1D

Issuing Committee: CE-12 Solid State Devices

Publisher: SAE International

Pages: 19

Rationale: This document is intended to provide guidance for Using Plastic Encapsulated Microcircuits and Semiconductors (PEMs) in Military, Aerospace, and other rugged applications. This document addesses the various qualification and monitoring testing of plastic encapsulated microcircuits and discrete semiconductors suitable for potential use in military and aerospace applications. The users can use this document to evaluate the potential suitability of a PEM product or the manufacturer for its intended application. SSB-1 Rev D has been updated from SSB-1 Rev C to take into account the comments from various CE-12 members. The changes from SSB-1 Rev C to SSB-1 Rev D are shown in Appendix A: (informative) Differences between SSB-1 Rev C and SSB-1 Rev D.