Technical Paper
Advance Grooved Heat Pipe for Space Satellite Thermal Control System
2009-07-12
2009-01-2501
In a near future, telecommunication satellites should be characterized by more and more dissipative payloads and platform. The heat dissipation of the only communication module (CM) could be more than three times higher than the current large satellite payloads. At the same time, the strong restricted requirements to mass and power budget of satellite subsystems lead to choice of mainly passive thermal control system, specifically with heat pipe integration. In such a context, the investigations of existing high performance grooved heat pipes, which are commonly used nowadays for thermal control of telecommunication and scientific satellites, as well as the ways of improve its heat dissipation performance are strongly relevant. This paper is devoted to the R&D of advanced design of grooved heat pipes (GHPs) with thin porous layer (TPL) on its inner surface.