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In this paper, we describe our accomplishments in infiltrating a carbon/carbon composite material with polycrystalline diamond. This development results in an ultra high thermal conductivity electronics baseplate featuring an electrically insulating coating with high thermal conductivity. ...This novel composite material exhibits thermal conductivity higher than all existing coldplate materials. We have prepared diamond-infiltrated composites, and characterized the resulting material including the thermal conductivity measurement of the base carbon/carbon, SEM and Raman spectroscopy, and DC electrical resistivity measurements of the integrated diamond/carbon/carbon composites. ...We have prepared diamond-infiltrated composites, and characterized the resulting material including the thermal conductivity measurement of the base carbon/carbon, SEM and Raman spectroscopy, and DC electrical resistivity measurements of the integrated diamond/carbon/carbon composites.

VGCF/carbon composites are unlike diamond in that, typical of most fiber reinforced composites, designed physical properties are incorporated into the composite through fiber architecture. ...VGCF/Carbon composites have been shown to demonstrate high thermal conductivity, comparable to that of CVD diamond, implying utility in high performance electronic packaging. ...VGCF/carbon composites are unlike diamond in that, typical of most fiber reinforced composites, designed physical properties are incorporated into the composite through fiber architecture. Thermal performance for die cooling is frequently determined by the thermal impedance of the package, measured from the junction to ambient, ϕja, or jucntion to case, ϕjc.

This material, designated “diamond/carbon/carbon composite,” consists of a carbon/carbon composite that is partially infiltrated with CVD diamond in the surface region.

Metal matrix composites (MMCs) reinforced with vapor-grown carbon fiber (VGCF) may offer thermal conductivity superior to materials currently used for thermal management while also providing an adjustable coefficient of thermal expansion (CTE) and low density.