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Innovations in Mobility: Aerospace Digital Summitaerospace mobility leaders convene leverage cutting-edge technology, design, develop safety measures, integrate current regulations, suggest future policies, expand markets, diversify revenue streams.

This document applies to the development of Plans for integrating and managing COTS assemblies in electronic equipment and Systems for the commercial, military, and space markets; as well as other ADHP markets that wish to use this document. For purposes of this document, COTS assemblies are viewed as electronic assemblies such as printed wiring assemblies, relays, disk drives, LCD matrices, VME circuit cards, servers, printers, laptop computers, etc. There are many ways to categorize COTS assemblies1, including the following spectrum: At one end of the spectrum are COTS assemblies whose design, internal parts2, materials, configuration control, traceability, reliability, and qualification methods are at least partially controlled, or influenced, by ADHP customers (either individually or collectively). An example at this end of the spectrum is a VME circuit card assembly.

Development of a new Industry Standard related to GIDEP Reporting.

This document applies to the development of Plans for integrating and managing electronic components in equipment for the military and commercial aerospace markets; as well as other ADHP markets that wish to use this document. Examples of electronic components, as described in this document, include resistors, capacitors, diodes, integrated circuits, hybrids, application specific integrated circuits, wound components, and relays. It is critical for the Plan owner to review and understand the design, materials, configuration control, and qualification methods of all “as-received” electronic components, and their capabilities with respect to the application; identify risks, and where necessary, take additional action to mitigate the risks. The technical requirements are in Clause 3 of this standard, and the administrative requirements are in Clause 4.

This document applies to the development of Plans for integrating and managing COTS assemblies in electronic equipment and Systems for the commercial, military, and space markets; as well as other ADHP markets that wish to use this document.

This document describes a process for use by ADHP integrators of EEE parts and sub-assemblies (items) that have been targeted for other applications. This document does not describe specific tests to be conducted, sample sizes to be used, nor results to be obtained; instead, it describes a process to define and accomplish application-specific qualification; that provides confidence to both the ADHP integrators, and the integrators’ customers, that the item will performs its function(s) reliably in the ADHP application.

Breathing Life into Artificial Intelligence and Next Generation Autonomous Aerospace Systems Robotic Rotational Molding Creates New Opportunities for Military and Aerospace Applications Rim-Driven Electric Aircraft Propulsion High-Speed Midwave Infrared Cameras Enable Military Test Range Tracking System What Today's Advances in Radar Technology Mean for Testing and Training Tackling Ruggedization Challenges for RF Communications in Software Defined Radios AUVSI XPONENTIAL 2023 The Blueprint for Autonomy Multi-Scale Structuring of the Polar Ionosphere Understanding a radically new sensing capability for polar ionospheric science introduced by observational evidence recently provided by the electronically steerable Resolute Bay Incoherent Scatter Radar (RISR). Stepped-Frequency Distributed Radar for Through-the-Wall Sensing A technical analysis of the effectiveness of distributed radar for through-the-wall sensing applications.

Annual conference government policy, regulatory makers, automotive industry neutral forum discuss US government regulation, technology, customer acceptance future vehicle design. industry event safety, emission control, fuel efficiency, automated vehicles.

Registration for the Government/Industry Meeting

Registration for the Government/Industry Meeting will be open on September 1, 2023. Please check back soon.