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Thermal analysis is typically performed using a point design approach, where a single model is analyzed one analysis case at a time. Changes to the system design are analyzed by updating the thermal radiation and conduction models by hand, which can become a bottleneck when attempting to adopt a concurrent engineering approach. This paper presents the parametric modeling features that have been added to Thermal Desktop™ to support concurrent engineering. The thermal model may now be characterized by a set of design variables that are easily modified to reflect system level design changes. Geometric features, optical and material properties, and orbital elements may all be specified using user-defined variables and expressions. Furthermore, these variables may be automatically modified by Thermal Desktop's optimization capabilities in order to satisfy user-defined design goals, or for correlating thermal models to test data.